Wakefield Thermal 690 Extruded Heat Sinks for TO Devices with Clip
Wakefield Thermal 690 Extruded Heat Sinks for TO devices with Clip are heat sinks designed for TO-126, TO-220, and TO-247 devices. These Wakefield Thermal aluminum extruded heat sinks offer an integrated, robust holding feature. The 690 series heat sinks provide a solderable retaining pin for PCB mounting and feature optimal heat transfer between the component and the heat sink.
Features
- Used for TO-126, TO-220, TO-247 devices
- Easy installation in TO devices
- Aluminum extruded heat sink with integrated, robust holding feature
- Optimal heat transfer between component and heat sink
- Solderable retaining pin for PCB mounting
- Material 6063-T5 aluminum with brass pin, black anodized
Specifications
- 692 series dimensions
- 25mm, 50mm, 75mm, or 100mm length
- 27.94mm height
- 10.92mm width
- 693 and 694 series dimensions
- 25mm, 50mm, 75mm, or 100mm length
- 35.05mm height
- 22mm width
- Solder-to-PCB attachment method
- Package cooled
- TO126 (692 series)
- TO220 (693 series)
- TO247 (694 series)
692 Dimensions & Thermal Performance
693 Dimensions & Thermal Performance
694 Dimensions & Thermal Performance
Related Heat Sinks
Wakefield Thermal omniKlip™ Heat Sinks for TO Packages
Configurable, high-performance, compact solution for TO-220, TO-247, TO-264, and similar packages.
Wakefield Thermal Heat Sink Extrusions & Profiles
Available in 1- and 3-foot lengths, manufactured by pushing hot aluminum billets through steel die.
Wakefield Thermal SKV High Power Skived Fin Heat Sinks
Alternatives to extruded heat sinks and manufactured using copper or aluminum with 0.5mm thick fins.
Wakefield Thermal DC/DC Power Brick Heat Sinks
Available in various fin heights and orientations.
Wakefield Thermal RAPID Heat Pipe CPU Coolers
Designed to draw heat away from the system CPU and other components in an enclosure.
Wakefield Thermal 960 Series Push-Pin Heat Sinks
Feature pre-assembled plastic push pins with a flexible barb that engage precisely with PCB holes.
Related Heat Sink Accessories
Wakefield Thermal 960 Series Push Pins for Heat Sinks
Designed to work with the 960 series heat sinks and offers an overheight range of 17.6mm to 22.1mm.
Related Thermal Interface Materials
Wakefield Thermal 127-12 Extreme Performance Sil-Free Thermal Grease
Feature extreme performance, phase change, and non-silicone with 12W/m-K thermal conductivity.
Wakefield Thermal DST Double-Sided Adhesive Thermal Tapes
Widely used to bond heat sinks to microprocessors and other power-consuming semiconductors.
Wakefield Thermal BT BondaTherm™ Thermal Interface Materials
Includes equalizer kits, dispense guns, static mixers and fast-curing thermally conductive adhesive.
Wakefield Thermal PL ulTIMiFlux High Performance Thermal Pads
A variety of sizes, thicknesses, conductivities, and durometers for a custom thermal solution.
Wakefield Thermal ulTIMiFlux™ Thermal Interface Materials
Excellent replacement for thermal greases designed to improve thermal transfer to the heat sink
Wakefield Thermal PLK ulTIMiFlux™ Gap Pad Evaluation Kits
Features excellent flame retardance and includes 9 varieties of thermal interface materials (TIMs).
Wakefield Thermal CD ulTIMiFlux™ Dielectric Phase Change TIM
Thermally conductive electrical insulators for semiconductor-to-heat sink interfaces
Wakefield Thermal WTC/WTI Omnipad Thermal Insulators
Highly efficient and designed for semiconductor-to-heat sink interfaces.
Related Heat Transfer Components
Wakefield Thermal Heat Pipe Thermal Solutions
High thermal performance, designed to transfer heat from one area to another or across a material.
Wakefield Thermal VC Vapor Chambers for High-Power Cooling
Used to transport heat to a large area from a small source or a collection of small sources.