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Wakefield Thermal
Wakefield Thermal is North America's leading provider of heat sinks. By converging with several synergistic companies over the years. Wakefield Thermal has been able to create stronger product diversification and to enhance its reputation for quality thermal solutions. Headquartered in New Hampshire, Wakefield Thermal is ISO 9001:2000 certified and excels in offering competitively priced thermal solutions for most industries, such as stamped and extruded board level heat sinks, BGA heat sinks, extruded heat sinks for high-powered semiconductors, DC-DC converter heat sinks, bonded fin heat sinks, and many accessory products for heat sinks.
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Wakefield Thermal FSW Friction Stir Welded Cold PlatesFeatures a solid-state welding method, which seamlessly joins metal pieces without melting them.5.7.2024 г.
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Wakefield Thermal DST Double-Sided Adhesive Thermal TapesWidely used to bond heat sinks to microprocessors and other power-consuming semiconductors.12.4.2024 г.
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Wakefield Thermal 484E Smart LeverIdeal for confidently securing heat frames within dynamic environments, left- or right-hand mount.10.1.2024 г.
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Wakefield Thermal 131097 Vacuum-Brazed Liquid Cold PlateCompatible with the industry’s power module devices, such as SiCs, GaNs, IGBTs, and SCRs.30.10.2023 г.
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Wakefield Thermal 127-12 Extreme Performance Sil-Free Thermal GreaseFeature extreme performance, phase change, and non-silicone with 12W/m-K thermal conductivity.27.9.2023 г.
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Wakefield Thermal 127-6 High-Performance, Sil-Free Thermal GreaseHigh-performance, non-silicone thermal grease syringe with 6W/m-K thermal conductivity.13.9.2023 г.
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Wakefield Thermal 452E Ejectors for Embedded CoolingA ready-to-go insertion and extraction solution for embedded computing heat frames.29.5.2023 г.
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Wakefield Thermal Heat Frame Assembly KitsManufactured from solid aluminum and can be designed for compliance with many industry standards.28.4.2022 г.
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Wakefield Thermal ulTIMiflux Gap Pad Evaluation KitFeatures excellent flame retardance and includes 9 varieties of thermal interface materials (TIMs).15.3.2022 г.