Wakefield Thermal VC Vapor Chambers for High-Power Cooling

Wakefield Thermal VC Series Vapor Chambers are used to transport heat to a large area from a small source or a collection of small sources. These chambers are a fluid-phase-change device, like a heat pipe, that transfers heat quickly via evaporation and condensation. The VC vapor chambers are made from copper plates (top and bottom) with an internal wick structure sealed around the perimeter, containing a small amount of fluid. These chambers feature a mesh or powder wick structure, with the copper plate surfaces allowing fluid flow in all directions within the vapor chamber. The vapor chambers are ideal for use in horizontal orientations, but when used at angles above 15° from horizontal, gravity can affect performance and should be considered. These lightweight vapor chambers are ideal for computers and data centers, telecommunications, aerospace, and transportation.

Features

  • Copper material
  • Copper mesh/powder wick structure
  • Lightweight
  • Versatile with high thermal performance

Applications

  • Computers and data centers
  • Telecommunications
  • Aerospace
  • Transportation
Wakefield Thermal VC Vapor Chambers for High-Power Cooling

Overview

Wakefield Thermal VC Vapor Chambers for High-Power Cooling

How Vapor Chambers Operate

Wakefield Thermal VC Vapor Chambers for High-Power Cooling

Vapor Chamber Basics

Chart - Wakefield Thermal VC Vapor Chambers for High-Power Cooling

Thermal Capacity

Chart - Wakefield Thermal VC Vapor Chambers for High-Power Cooling

Dimensions

Mechanical Drawing - Wakefield Thermal VC Vapor Chambers for High-Power Cooling
Published: 2026-06-09 | Updated: 2026-10-16