All Results (1.100)

Development Boards & Kits - x86 EVALUATION CARRIER BRD COM EXP TYPE 10

Computer-On-Modules - COM JUMPtec COMe-mBTi10 E3815 1E/2S

Heat Sinks Standard heatspreader for COM-HPC module conga-HPC/mRLP. All standoffs are with 2.7mm bore hole.

Computer-On-Modules - COM JUMPtec COMe-mAL10 E2 E3950 8E

Computer-On-Modules - COM COM Express Compact module with Intel Atom x5-E3940 quad core processor with 1.6GHz core frequency up to 1.8GHz, 2MB L2 cache and up to 8GB 1866MT/s DDR3L SODIMM memory support. Industrial grade temperature range from -40 C to 85 C.

Computer-On-Modules - COM SMARC 2.1 module with Intel Atom x6413E quad core processor with 1.5GHz core frequency up to 3.0GHz, 1.5MB cache, 8GB 3200MT/s LPDDR4x onboard memory and 32GB eMMC onboard flash.

Heat Sinks HSP COMe-mAL10 E2 thread

CPU & Chip Coolers HSP COMe-cAP6 Cu-core threaded

Development Boards & Kits - x86 3.5 Carrier Board for SMARC 2.0 modules with x86 CPUDimensions are 146mm x 102 mm (5.74" x 4.02")Operating Temperature: 0 C to 60 C (commercial)

Heat Sinks Passive cooling for SMARC 2.0 module conga-SA5* For modules with IHS Intel Atom CPU* All stand-offs are bore hole 2.7mm

Computer-On-Modules - COM SMARC 2.1 module with low-power 14nm NXP i.MX 8M Plus Quad processor. Features 4x ARM Cortex-A53 @1.6GHz +1x ARM Cortex-M7 + NPU, 2GB onboard LPDDR4 memory and 16GB onboard eMMC. Industrial grade temperature range from -40 C to 85 C.

Development Boards & Kits - Other Processors COM-HPC Client 3.5 carrier board suitable for congatec COM-HPC modules with Size M (Mini).