Texas Instruments TPSM82866C Step-Down MagPack™ Power Module

Texas Instruments TPSM82866C Step-Down MagPack™ Power Module is an ultra-small 6A step-down module with an integrated inductor and I²C interface. This module features a 5.5V input in a MagPack package with dimensions of only 2.3mm x 3mm, supplying a power density of nearly 1A per 1mm² of area. The MagPack technology from TI integrates a synchronous step-down converter and an inductor to simplify designs, save PCB area, and reduce external components. The I²C interface offers an effective way to adjust the output voltage, set the V_OUT ramp rate when transitioning to a new setpoint, and read status information such as thermal warnings or current limit flags. Overtemperature and hiccup short-circuit protections provide a robust and reliable design. Texas Instruments TPSM82866C Step-Down MagPack Power Module are compact and efficient, making them ideal for automated assembly via standard surface-mount equipment.

Features

Up to 96% efficiency
Excellent thermal performance
I²C-compatible interface up to 3.4Mbps
I²C programmable
- Output voltage
  - 0.4: 1.675V in 5mV steps
  - 0.8: 3.35V in 10mV steps
- Forced PWM or power save mode
- Output voltage discharge
I²C device status readback of
- Thermal warning
- Hiccup current limit
- Vin below UVLO

Resistor selectable
- I²C address
- 16 start-up output voltage options
1% output voltage accuracy
DCS-control topology for fast transient response
4µA operating quiescent current
Optimized for low EMI requirements
- No bond wire package
- MagPack technology shields inductor and IC
- Simplified layout through optimized pinout
-40°C to +125°C operating temperature range
2.3mm x 3mm x 1.95mm QFN package
28mm² design size