TE Connectivity / Linx Technologies microSplatch® uSP410 Chip Antennas
TE Connectivity's (TE) Linx Technologies microSplatch® uSP410 Chip Antennas are surface-mount monopole chip antennas that target ISM, LoRaWAN®, Sigfox®, and other low-power, wide-area (LPWA) and remote control applications. The uSP410 design uses a grounded-line technique to achieve outstanding performance when subject to nearby sources of interference. TE Connectivity / Linx Technologies microSplatch uSP410 Chip Antennas are available in tape-and-reel packaging and are designed for reflow-solder mounting directly to a printed circuit board for high-volume applications. Evaluation boards with a pre-mounted antenna and SMA connector are also available.
Features
- 13.2mm x 9.1mm x 2.9mm package
- Excellent performance with small ground plane (84mm x 38mm)
- Resistant to proximity effect from nearby interferers
- Direct surface-mount PCB attachment
- Reflow- or hand-solder assembly
- Available in tape-and-reel packaging
Applications
- ISM
- LPWA
- LoRaWAN
- Sigfox
- Wi-Fi HaLow™
- Remote controls
- Smart home networking
- Sensing and remote monitoring
- Internet of Things (IoT) devices
Specifications
- Common
- -40°C to +130°C operating temperature range
- 5W max. power
- 50Ω impedance
- Performance at 430MHz to 435MHz
- 5% efficiency
- -8dBi peak gain
- ≤1.5 VSWR
- Performance at 862MHz to 876MHz
- 20% efficiency
- 0.7dBi peak gain
- ≤2.1 VSWR
- Performance at 902MHz to 930MHz
- 27% efficiency
- 0.9dBi peak gain
- ≤2.9 VSWR
Datasheets
Published: 2020-08-24
| Updated: 2024-09-30