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Amphenol TCS HD Express® Interconnect System

Amphenol TCS HD Express® Interconnect System is a high-performance, high-density backplane solution designed to meet PCIe Generation 6 mechanical and electrical requirements for 85Ω impedance systems. Engineered with a single-wafer design, this system enables easy system scaling and offers a competitive cost structure. All press-fit pins ensure reliable board terminations, making the Amphenol TCS HD Express Interconnect System ideal for servers, storage, and high-performing applications.

Features

  • Supports PCIe Generation 6 links
  • Press-fit technology
  • High density
  • Ground structure on all 4 sides of mating beams of each differential pair
  • Beam on blade
  • Diecast guide module
  • Single-wafer design using traditional design elements
  • High signal isolation performance

Applications

  • Servers
  • Storage
  • Supercomputers

Specifications

  • 85Ω impedance
  • 13.8 mil drill-compliant pin
  • Electrical performance
    • <30VAC(RMS) rated voltage (UL agency)
    • TBD dielectric withstanding voltage
    • 10mΩ maximum contact resistance change
  • Material
    • Gold contact finish area
    • Copper alloy contact base material
    • Glass-reinforced polyester (LCP) housing
  • UL 94V-0 rating
  • -40°C to 105°C operating temperature range

Mechanical Drawings

Published: 2025-02-19 | Updated: 2025-10-07