Bergquist Company TGP 30000SF 30W/m-K Silicone Free GAP PADs®
Bergquist Company TGP 30000SF 30W/m-K Silicone Free GAP PADs® support 20% to 50% compressibility with reworkable and pick-and-place functionality. Bergquist Company TGP 30000SF 30W/m-K Silicone Free GAP PADs feature 30W/m-K conductivity, a 77-hardness rating, and 1000hr thermal cycling capabilities. The GAP PADs are designed for integration in telecom infrastructure, aerospace and satellite systems, and automotive advanced driver assistance systems (ADAS).
Features
- Silicone-free polymer
- 20% to 50% compressibility
- Elastomeric pad
- Manual or automated pick-and-place functionality
- Reworkable functionality
- One-sided tacky layer
- Z-axis orientation
- 8" x 8" sheets
- 0.5mm to 3.2mm thickness range
- Electrically non-insulating, unreinforced material
- Elastomeric thermal interface material (TIM)
- 3mil PET and optional 4mil removable liners
Applications
- AI data center, telecom infrastructure, and high-performance computing
- High-power, mission-critical systems, including aerospace and satellite
- Automotive ADAS
Specifications
- 30W/m-K, 0.12K-cm2/W conductivity at 50psi
- 77-hardness rating per Shore 00, ASTM D2240
- 1.6g/cc density rating per ASTM D792
- 1.1j/g-K heat capacity per ASTM E1269
- 110psi peak stress at 30% strain
- 20psi relaxed stress after 5 minutes
- 1000hr thermal cycling at -40°C to +125°C
- 1000hr thermal cycling at +85°C, 85% RH exposure
Additional Resources
Application Examples
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