Bergquist Company TGF 3000SF 3.0W/m-K, Sil-Free Gap Filler
Bergquist TGF 3000SF 3.0W/m-K, Sil-Free Gap Filler is a two-part, silicone-free liquid TIM gap filler that provides thermal conductivity of 3.0W/m-K. The filler also offers a fast dispense rate conducive to mass production environments and high dielectric strength for outstanding electrical performance. Bergquist TGF 3000SF 3.0W/m-K, Sil-Free Gap Filler offers high-reliability performance, no concerns of silicone contamination, and low stress on sensitive components. This material can be used in multiple applications, including industrial automation/power conversion, automotive electronics, and computers/peripherals.
Features
- 3.0W/m-K thermal conductivity
- Dispensable liquid, 2K silicone-free gap filler
- Room temperature cure, no oven required
- High thermal performance up to +100°C
- Extremely high dispense rate, equipment dependent
- Low compression stress during assembly
- High reliability
- No outgassing interference
- High throughput
- 1:1 mixing ratio
- UL 94V-0 rated
- Halogen free and RoHS compliant
Applications
- Power/industrial automation
- Power inverters
- SMD power switching
- EV chargers
- Automotive
- Audio amplification
- Infotainment systems
- Power conversion
- Electronics
- Memory
- SOC
- High thermal ICs dissipation required
Specifications
- 74 hardness (shore 00)
- >10kV/mm dielectric strength
- -40°C to +100°C application temperature range
- Room temperature storage
- Full cure in 3 hours at +85°C
- 6-month shelf life
- 1.5cc/second dispense rate
- >12-hour working time
- 3.0g/cc density
- 1008Ω-m volume resistivity
Videos
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Published: 2021-10-09
| Updated: 2023-03-07