Allegro MicroSystems ACS37220 EZ Package Evaluation Boards

Allegro MicroSystems ACS37220 EZ Package Evaluation Boards allow for the quick evaluation of Allegro current sensors in a lab setting without needing a custom circuit board. Allegro MicroSystems ACS37220 boards feature enhanced thermal performance. The boards have a 6-layer PCB with a 2-ounce copper weight on all layers.

Features

  • Enhanced thermal performance
    • 6-layer PCB with 2oz copper weight on all layers
    • Nonconductive filled Via-In-Pad used
    • High-performance FR4 material with +180°C glass transition temperature
  • Flexible instrument connection, standard keystone test points, SMA/SMB connector, or 2-pin headers options are provided
  • Sensor-integrated current loop resistance can be measured directly on the evaluation board; voltage drop can be measured for approximating power loss in the package

Kit Contents

  • Printed circuit board with populated components
  • Available ACS37220 board variants
    • ASEK37220LEZA-100B3
    • ASEK37220LEZA-150B3
    • ASEK37220LEZA-100B5
    • ASEK37220LEZA-150B5
    • ASEK37220LEZA-200B5

Overview

1. U1 is an EZ package footprint (Pin 1 is on the bottom left side; see the small white dot on the PCB)
2. U1 pins allow the option to connect, RPU: pull-up resistor to VCC, RPD: pull-down resistor to GND, C: decoupling or load capacitor to GND, all passive components are 0603 package size
3. Keystone 5005 test points
4. Standard SMB/SMA connector 
5. 2-pin 100 mil header connector option (note: either SMB or header can be assembled)
6. Primary current cables mounting positions (positive current flow direction is left to right)
7. 2-pin 100 mil header connector for voltage drop measurement across the integrated current loop of the current sensor
8. RB1, RB2, RB3, and RB4: rubber bumper mounting positions

Videos

Published: 2024-04-09 | Updated: 2025-09-29