3M Aerospace & Defense EMI/RFI Management Solutions
3M Aerospace and Defense EMI/RFI Management Solutions improve the reliability of critical electronics and provide solutions for the unique challenges of harsh environments. These solutions help increase signal-to-noise ratios, enabling devices to operate at peak efficiency within their electromagnetic environments. The aerospace and defense EMI/RF solutions absorb EMI to help improve signal quality and maintain consistently clear signals over a wide range of frequencies. These solutions avoid electrical system redesign by offering quick, easy peel-and-stick adhesive applications. The EMI-absorbing solutions provide thickness-dependent absorption, improved antenna performance, and reduced EMI interference. The EMI shielding and grounding provide XYZ-axis or Z-axis conductivity and excellent electrical resistance for small contact areas. Typical applications include ESD, PIM management, computer systems, frame structures for mechanical bodies, cable wrapping/attachment, and bond-line gap shielding.
Features
- EMI absorbing:
- Absorbing capabilities up to 6GHz or 10GHz with targeted permeability
- Absorbing performance is thickness-dependent
- Improved antenna performance and reduced EMI interference
- Multiple thickness options for diverse applications
- Supplied on a removable liner for easy handling
- Halogen-free products available
- EMI shielding and grounding:
- XYZ-axis or Z-axis conductivity
- Excellent electrical resistance for small contact areas
- High adhesion for reliable contact to various substrates
- Great handling and workability
- Great EMI shielding in the bond line gap
- Multiple levels of adhesion, conformability, and flexibility
- Broad range of thicknesses for different gap size
Applications
- EMI shielding and grounding:
- Shielding display wrap
- Flex circuit to flex circuit interconnection
- Shield can lid
- Sensor grounding
- Display chip on flex
- PCB/flex/chassis grounding
- Electrostatic Discharge (ESD)
- EMI shield and gasket attachment
- FPC grounding
- Bond line gap shielding
- PIM management
- Computer systems
- Frames of mechanical bodies
- EMI absorbing:
- Cable wrapping/attachment
- Attached to noise (traces, ICs, and reflective enclosure surfaces)
- Attached to metal surfaces (reduces emitting EMI noise)
- Bond line gap shielding
- Attached to the Semicon chip/microprocessors
- Insert between modules
Additional Resources
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