FRAMOS FSM:GO-IMX900M 3.2MP Optical Sensor Modules

FRAMOS FSM:GO-IMX900M 3.2MP Optical Sensor Modules feature the Sony IMX900AQR/AMR sensor on a compact 26.5mm x 26.5mm x 2.77mm (WxDxH) module. The global shutter sensor has a native resolution of 3.2MP and an optical format of 1/3.1" at a pixel size of 2.25µm x 2.25µm. The modules provide a MIPI CSI-2 interface with up to four data lanes and a D-PHY v2.1 interface. As part of the FRAMOS Sensor Module Ecosystem, these devices are part of a sophisticated connectivity framework and leverage flexible compatibility to several processing platforms accessing a broad lineup of adapters. Optional FRAMOS Sensor Adapters (FSA) establish the standard interface to a lineup of FRAMOS Processor Adapters (FPA), allowing connectivity to various proprietary processing platforms. A standardized Software Pack further supports the customer-specific implementation, including reference drivers for selected platforms, including the NVIDIA^® Jetson™ AGX Orin™ development boards.

Features

Sensor module
- Sony IMX900AQR/AMR type
- CMOS global shutter type
- Pregius S technology
- Mono or color (RGB) spectrum
- 1/3.1" optical format
- 2.25µm x 2.25µm pixel size
- 2064x1552 maximum resolution
- Maximum framerates
  - 125FPS for 8-bit
  - 117FPS for 10-bit
  - 72FPS for 12-bit
- 8/10/12-bit depth (platform dependent)
Platform support (driver, ISP)
- NVIDIA Orin family
- NXP i.MX8MP
-30°C to +75°C operating temperature range

Interface options
- MIPI CSI-2 v1.2 and D-PHY v2.1
  - PixelMate (60-pin), Micro-Coax (50-pin), and FFC (40-pin, unshielded) physical interfaces
  - I²C communication
  - Two rail (3.8V, 1.8V) power supply
  - 420mW maximum power consumption
- GMSL3 (12Gbps)
  - FAKRA (single-coax) physical interface
  - I²C communication
  - Power over coax (12V)
  - 1200mW maximum power consumption
Mechanical
- 26.5mm x 26.5mm x 2.77mm (WxDxH) size
- None/board-level housing
95% maximum relative humidity (RH), non-condensing