New Thermal Interface Products
Bergquist Company TGP 30000SF 30W/m-K Silicone Free GAP PADs® support 20% to 50% compressibility with reworkable and pick-and-place functionality. Bergquist Company TGP 30000SF 30W/m-K Silicone Free GAP PADs feature 30W/m-K conductivity, a 77-hardness rating, and 1000hr thermal cycling capabilities. The GAP PADs are designed for integration in telecom infrastructure, aerospace and satellite systems, and automotive advanced driver assistance systems (ADAS).
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Bergquist Company TGP 30000SF 30W/m-K Silicone Free GAP PADs®Support 20% to 50% compressibility with reworkable and pick-and-place functionality.13.10.2026
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Qnity Tgrease™ 3000 Thermal GreaseSupports higher operating temperatures (+200°C), especially for SiC and GaN power semiconductors.21.08.2026 -
StarTech High-Performance Silicone Thermal PasteDesigned for efficient heat transfer and safe application in various environments.08.04.2026 -
Bourns BTJ Thermal Jumper ChipsUnique surface-mount components that provide high thermal conductivity for thermal dissipation.02.02.2026 -
Advanced Thermal Solutions Thermal Transfer Plates for NVIDIA® Jetson™Designed for targeted heat management for NVIDIA® Jetson™ modules lacking integrated thermal plates.06.11.2025 -
Qnity Tflex™ HR6.5 Thermal Gap FillerThermal interface material with >6W/mK thermal conductivity with high recovery properties.15.09.2025 -
Qnity Tflex™ CR350S 2-Part Dispensable Gap FillersProvide high thermal conductivity, low thermal resistance, and high reliability.09.09.2025 -
Qnity Tputty™ SF560 1-Part Dispensable Gap FillersOffers thermal conductivity of 5.6W/mK, along with superior thermal resistance.25.08.2025 -
Wakefield Thermal WTC/WTI Omnipad Thermal InsulatorsHighly efficient and designed for semiconductor-to-heat sink interfaces.23.07.2025 -
Wakefield Thermal CD ulTIMiFlux™ Dielectric Phase Change TIMThermally conductive electrical insulators for semiconductor-to-heat sink interfaces23.07.2025 -
Qnity Tflex™ CR550 2-Part Dispensable Gap FillerTransfers unwanted heat in automotive components and the A+B putty material cures in place.25.10.2024 -
Qnity Tflex SF4 Thermal Gap FillersSilicon-free and offers a 0.5mm to 4mm thickness range with 4.0W/mK thermal conductivity.10.09.2024 -
Qnity Tflex SF7 Thermal Gap FillersInnovative, high-performing thermal material with silicone-free construction.10.09.2024 -
Bergquist Company TGF 2900LVO 2.9W/m-K Limited Outgassing Gap FillerSilicone, two-part room-temperature curable gap filler ideal for electronic assembly applications.30.05.2024 -
Bergquist Company TGP 40000SF 40W/m-K Silicone Free GAP PAD®Features gap-filling materials that achieve an ultra-high 40W/m-K thermal conductivity.27.05.2024 -
Stackpole Electronics TMJ Surface Mount Thermal Jumper Chip ResistorsFeatures chip sizes ranging from 0603 to 2512.18.01.2024 -
MG Chemicals Non-Silicone Liquid Thermal Gel1-part gel that offers extreme thermal conductivity and flame retardancy.30.10.2023 -
LeaderTech TCF Ultra-Thin Carbon Fibre Thermal PadsLow thermal resistance, soft surface, and mainly uses carbon fibre as a thermally conductive filler.18.10.2023 -
LeaderTech TGN Ultra-Thin Thermal PadsFeatures low thermal resistance and is manufactured by combining graphene and silicone.18.10.2023 -
LeaderTech TCI Composite Indium SheetTransitions from solid to liquid at its melting point and back to solid again at room temperature.18.10.2023 -
Wakefield Thermal 127-12 Extreme Performance Sil-Free Thermal GreaseFeature extreme performance, phase change, and non-silicone with 12W/m-K thermal conductivity.27.09.2023 -
Qnity CoolZorb 200 Hybrid TIM/EMI AbsorbersHybrid absorber/thermal management materials used for EMI mitigation and heat dissipation.08.09.2023 -
Bergquist Company Data Centre ApplicationsAdvanced materials help with thermal management, long-term reliability, and stress protection.01.04.2023