Laird Resources & Support
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Resources
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Brochures
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Case Studies
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White Papers
- 5G mmWave Materials
- A Basic Overview of EMI Shielding Techniques & Concepts
- Absorber Solutions for Industrial and Telecom Applications
- Automotive EMI Shielding – Controlling Automotive Electronic Emissions and Susceptibility with Proper EMI Suppression Methods
- Comparing Liquid Gap Fillers and Gap Filler Pads: Which Is Right for Your Electronics Cooling Needs?
- Dampening Cavity Resonance Using Absorber Material
- EMI, SI, and PI: Overcoming Common Challenges in the Design of Power Electronics
- Ensuring Optimal EMI-EMC Automotive System Performance
- How Laird™ Bmi-S-608 Shield Frame Delivers Emi and Thermal Performance in Tight Automotive Controller Designs
- How Military Vehicle Engineering Teams Can Bridge the Design Wall
- How to Choose the Right Thermal Interface Materials Types Compounds and Specifications
- How to Specify Inductive Components in Power Electronics: Types, Specifications, and Uses
- Rethinking the Material Stackup in Next-Generation Automotive
- Selecting the Right Thermal Gap Filler for High-Performance Electronics
- The Engineer’s Application Overview EMI Shielding
- Thermal Design Challenges at the PCB Level: Identifying the Cause