200 MHz SRAM

Results: 1.234
Select Image Part # Mfr. Description Datasheet Availability Pricing (EUR) Filter the results in the table by unit price based on your quantity. Qty. RoHS ECAD Model Memory Size Organisation Access Time Maximum Clock Frequency Interface Type Supply Voltage - Max Supply Voltage - Min Supply Current - Max Minimum Operating Temperature Maximum Operating Temperature Mounting Style Package/Case Packaging
ISSI SRAM 72Mb,Pipeline,Sync,4Mb x 18,200Mhz,3.3V or 2.5V I/O,100 Pin TQFP, RoHS Non-Stocked Lead-Time 26 Weeks
Min.: 800
Mult.: 800
: 800

72 Mbit 4 M x 18 3.1 ns 200 MHz Parallel 3.3 V 2.5 V 360 mA - 40 C + 85 C SMD/SMT TQFP-100 Reel
ISSI SRAM SYNC.PIPE,200MHz,3CE 512K x18, 3.3v I/O Non-Stocked Lead-Time 26 Weeks
Min.: 72
Mult.: 72

9 Mbit 512 k x 18 3.1 ns 200 MHz Parallel 3.465 V 3.135 V 160 mA - 40 C + 85 C SMD/SMT TQFP-100
ISSI SRAM 18Mb,Pipeline,Sync,512K x 36,200MHz,3.3v or 2.5v I/O, 165 Ball BGA, Lead Free Non-Stocked Lead-Time 26 Weeks
Min.: 2.000
Mult.: 2.000
: 2.000

18 Mbit 512 k x 36 3 ns 200 MHz 3.465 V 3.135 V 240 mA - 40 C + 85 C SMD/SMT FBGA-165 Reel
ISSI SRAM 18Mb,Pipeline,Sync,512K x 36,200MHz,3.3v or 2.5v I/O, 100 Pin TQFP, Lead Free Non-Stocked Lead-Time 26 Weeks
Min.: 800
Mult.: 800
: 800

18 Mbit 512 k x 36 3 ns 200 MHz 3.465 V 3.135 V 240 mA - 40 C + 85 C SMD/SMT TQFP-100 Reel
ISSI SRAM 18Mb,"No-Wait"/Pipeline,Sync,1Mb x 18,200Mhz,3.3v/2.5v - I/O,165 Ball BGA, RoHS Non-Stocked Lead-Time 26 Weeks
Min.: 144
Mult.: 144

18 Mbit 1 M x 18 3 ns 200 MHz 3.3 V 2.5 V 0 C + 70 C SMD/SMT FBGA-165 Tray
ISSI SRAM 18Mb,"No-Wait"/Pipeline,Sync,1Mb x 18,200Mhz,3.3v/2.5v - I/O,165 Ball BGA, RoHS Non-Stocked Lead-Time 26 Weeks
Min.: 1
Mult.: 1

18 Mbit 3.1 ns 200 MHz 3.465 V 3.135 V 475 mA - 40 C + 85 C SMD/SMT FBGA-165 Tray
ISSI SRAM 36Mb,"No-Wait"/Pipeline,Sync,1Mb x 36,200Mhz,3.3v/2.5v I/O, 165 Ball BGA, RoHS Non-Stocked Lead-Time 26 Weeks
Min.: 2.000
Mult.: 2.000
: 2.000

36 Mbit 1 M x 36 3.1 ns 200 MHz 3.465 V 3.135 V 260 mA - 40 C + 85 C SMD/SMT FBGA-165 Reel
ISSI SRAM 36Mb,"No-Wait"/Pipeline,Sync,1Mb x 36,200Mhz,3.3v/2.5v I/O,100 Pin TQFP, RoHS Non-Stocked Lead-Time 26 Weeks
Min.: 800
Mult.: 800
: 800

36 Mbit 1 M x 36 3.1 ns 200 MHz 3.465 V 3.135 V 260 mA - 40 C + 85 C SMD/SMT TQFP-100 Reel
ISSI SRAM 36Mb, 200Mhz 1M x 36 Sync SRAM Non-Stocked Lead-Time 26 Weeks
Min.: 144
Mult.: 144

36 Mbit 1 M x 36 3.1 ns 200 MHz Parallel 3.465 V 3.135 V 260 mA - 40 C + 85 C SMD/SMT FBGA-165
ISSI SRAM 18Mb,"No-Wait"/Pipeline,Sync,1Mb x 18,200Mhz,3.3v/2.5v - I/O,165 Ball BGA, RoHS Non-Stocked Lead-Time 26 Weeks
Min.: 2.000
Mult.: 2.000
: 2.000

18 Mbit 1 M x 18 3 ns 200 MHz 3.3 V 2.5 V 0 C + 70 C SMD/SMT FBGA-165 Reel
ISSI SRAM 4Mb,"No-Wait"/Pipeline,Sync with ECC,128K x 36,200Mhz,3.3v I/O, 165 Ball BGA, RoHS Non-Stocked Lead-Time 26 Weeks
Min.: 2.000
Mult.: 2.000
: 2.000

4 Mbit 128 k x 36 3.1 ns 200 MHz 3.465 V 3.135 V 210 mA - 40 C + 85 C SMD/SMT FBGA-165 Reel
ISSI SRAM 4Mb,"No-Wait"/Pipeline,Sync,256K x 18,200Mhz,3.3v I/O,165 Ball BGA, RoHS Non-Stocked Lead-Time 26 Weeks
Min.: 144
Mult.: 144

4 Mbit 256 k x 18 3.1 ns 200 MHz Parallel 3.465 V 3.135 V 210 mA - 40 C + 85 C SMD/SMT FBGA-165 Tray
ISSI SRAM 8Mb,"No-Wait"/Pipeline,Sync,256K x 36,200Mhz,3.3v I/O, 165 Ball BGA, RoHS Non-Stocked Lead-Time 26 Weeks
Min.: 2.000
Mult.: 2.000
: 2.000

9 Mbit 256 k x 36 3.1 ns 200 MHz Parallel 3.465 V 3.135 V 180 mA - 40 C + 85 C SMD/SMT BGA-165 Reel
ISSI SRAM 4Mb,"No-Wait"/Pipeline,Sync with ECC,128K x 36,200Mhz,3.3v I/O, 165 Ball BGA, RoHS Non-Stocked Lead-Time 26 Weeks
Min.: 144
Mult.: 144

4 Mbit 128 k x 36 3.1 ns 200 MHz 3.465 V 3.135 V 210 mA - 40 C + 85 C SMD/SMT FBGA-165
ISSI SRAM 18Mb,"No-Wait"/Pipeline,Sync,512K x 36,200Mhz,3.3v/2.5v - I/O,165 Ball BGA, RoHS Non-Stocked Lead-Time 26 Weeks
Min.: 2.000
Mult.: 2.000
: 2.000

18 Mbit 512 k x 36 3 ns 200 MHz Parallel 3.465 V 3.135 V 240 mA - 40 C + 85 C SMD/SMT FBGA-165 Reel
ISSI SRAM 18Mb,"No-Wait"/Pipeline,Sync,512K x 36,200Mhz,3.3v/2.5v - I/O,100 Pin TQFP, RoHS Non-Stocked Lead-Time 26 Weeks
Min.: 800
Mult.: 800
: 800

18 Mbit 512 k x 36 3 ns 200 MHz Parallel 3.465 V 3.135 V 240 mA - 40 C + 85 C SMD/SMT TQFP-100 Reel
ISSI SRAM 18Mb,"No-Wait"/Pipeline,Sync,512K x 36,200Mhz,2.5v - I/O,100 Pin TQFP, RoHS Non-Stocked Lead-Time 26 Weeks
Min.: 1
Mult.: 1

18 Mbit 512 k x 36 3.1 ns 200 MHz Parallel 2.625 V 2.375 V 475 mA - 40 C + 85 C SMD/SMT TQFP-100 Tray
ISSI SRAM 18M (512Kx36) 200MHz Sync SRAM 2.5v Non-Stocked Lead-Time 26 Weeks
Min.: 800
Mult.: 800
: 800

18 Mbit 512 k x 36 3.1 ns 200 MHz Parallel 2.625 V 2.375 V 475 mA - 40 C + 85 C SMD/SMT TQFP-100 Reel
ISSI SRAM 18Mb No-Wait/ Pipeline Sync Non-Stocked Lead-Time 26 Weeks
Min.: 144
Mult.: 144

18 Mbit 512 k x 36 3 ns 200 MHz Parallel 2.625 V 2.375 V 240 mA - 40 C + 85 C SMD/SMT FBGA-165
ISSI SRAM 18Mb No-Wait/ Pipeline Sync Non-Stocked Lead-Time 26 Weeks
Min.: 72
Mult.: 72

18 Mbit 512 k x 36 3 ns 200 MHz Parallel 2.625 V 2.375 V 240 mA - 40 C + 85 C SMD/SMT TQFP-100
ISSI SRAM 18Mb No-Wait/ Pipeline Sync Non-Stocked Lead-Time 26 Weeks
Min.: 2.000
Mult.: 2.000
: 2.000

18 Mbit 512 k x 36 3 ns 200 MHz Parallel 2.625 V 2.375 V 240 mA - 40 C + 85 C SMD/SMT FBGA-165 Reel
ISSI SRAM 18Mb No-Wait/ Pipeline Sync Non-Stocked Lead-Time 26 Weeks
Min.: 800
Mult.: 800
: 800

18 Mbit 512 k x 36 3 ns 200 MHz Parallel 2.625 V 2.375 V 240 mA - 40 C + 85 C SMD/SMT TQFP-100 Reel
ISSI SRAM 18Mb,"No-Wait"/Pipeline,Sync,512K x 36,200Mhz,2.5v - I/O,165 Ball BGA, RoHS Non-Stocked Lead-Time 26 Weeks
Min.: 144
Mult.: 144

18 Mbit 512 k x 36 3.1 ns 200 MHz Parallel 2.625 V 2.375 V 475 mA - 40 C + 85 C SMD/SMT FBGA-165 Tray
ISSI SRAM 72Mb,Pipeline,Sync,2Mb x 36,200MHz,2.5V I/O,100 Pin TQFP,RoHS Non-Stocked Lead-Time 26 Weeks
Min.: 72
Mult.: 72

72 Mbit 2 M x 36 3.1 ns 200 MHz Parallel 2.625 V 2.375 V 450 mA - 40 C + 85 C SMD/SMT TQFP-100 Tray
ISSI SRAM 72Mb,Pipeline,Sync,2Mb x 36,200MHz,2.5V I/O,100 Pin TQFP,RoHS Non-Stocked Lead-Time 26 Weeks
Min.: 800
Mult.: 800
: 800

72 Mbit 2 M x 36 3.1 ns 200 MHz Parallel 2.625 V 2.375 V 450 mA - 40 C + 85 C SMD/SMT TQFP-100 Reel