DRAM

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Qty. RoHS ECAD Model Type
Memory Size
Data Bus Width
Maximum Clock Frequency
Package/Case
Organisation
Access Time
Supply Voltage - Min
Supply Voltage - Max
Minimum Operating Temperature
Maximum Operating Temperature
Series
Packaging
Zentel Japan DRAM DDR3 2Gb, 256Mx8, 2133 at CL14, 1.5V, FBGA-78, Ind. Temp.
Datasheet
Non-Stocked Lead-Time 28 Weeks
Min.: 2.420
Mult.: 2.420

SDRAM - DDR3 2 Gbit 8 bit 1.066 GHz FPGA-78 256 M x 8 1.425 V 1.575 V - 40 C + 95 C DDR3 Tray
Zentel Japan DRAM DDR3L 2Gb, 256Mx8, 2133 at CL14, 1.35V, FBGA-78
Datasheet
Non-Stocked Lead-Time 24 Weeks
Min.: 2.420
Mult.: 2.420

SDRAM - DDR3L 2 Gbit 8 bit 1.066 GHz FPGA-78 256 M x 8 1.283 V 1.45 V 0 C + 95 C DDR3L Tray
Zentel Japan DRAM DDR3&DDR3L 2Gb, 128Mx16, 1866 at CL13, 1.35V&1.5V, FBGA-96
Datasheet
Non-Stocked Lead-Time 16 Weeks
Min.: 2.090
Mult.: 2.090

SDRAM - DDR3L 2 Gbit 16 bit 933 MHz FPGA-96 128 M x 16 1.283 V 1.575 V 0 C + 95 C DDR3(L) Tray
Zentel Japan DRAM DDR3 2Gb, 128Mx16, 2133 at CL14, 1.5V, FBGA-96
Datasheet
Non-Stocked Lead-Time 24 Weeks
Min.: 2.090
Mult.: 2.090

SDRAM - DDR3 2 Gbit 16 bit 1.066 GHz FPGA-96 128 M x 16 1.425 V 1.575 V 0 C + 95 C DDR3 Tray
Zentel Japan DRAM DDR3 2Gb, 128Mx16, 2133 at CL14, 1.5V, FBGA-96, Ind. Temp.
Datasheet
Non-Stocked Lead-Time 28 Weeks
Min.: 2.090
Mult.: 2.090

SDRAM - DDR3 2 Gbit 16 bit 1.066 GHz FPGA-96 128 M x 16 1.425 V 1.575 V - 40 C + 95 C DDR3 Tray
Zentel Japan DRAM DDR3L 2Gb, 128Mx16, 2133 at CL14, 1.35V, FBGA-96
Datasheet
Non-Stocked Lead-Time 24 Weeks
Min.: 2.090
Mult.: 2.090

SDRAM - DDR3L 2 Gbit 16 bit 1.066 GHz FPGA-96 128 M x 16 1.283 V 1.45 V 0 C + 95 C DDR3L Tray
Zentel Japan DRAM DDR3&DDR3L 4Gb, 512Mx8, 1866 at CL13, 1.35V&1.5V, FBGA-78
Datasheet
Non-Stocked Lead-Time 16 Weeks
Min.: 2.420
Mult.: 2.420

SDRAM - DDR3L 4 Gbit 8 bit 933 MHz FPGA-78 512 M x 8 1.283 V 1.575 V 0 C + 95 C DDR3(L) Tray
Zentel Japan DRAM DDR3&DDR3L 4Gb, 512Mx8, 1866 at CL13, 1.35V&1.5V, FBGA-78, Ind. Temp.
Datasheet
Non-Stocked Lead-Time 20 Weeks
Min.: 2.420
Mult.: 2.420

SDRAM - DDR3L 4 Gbit 8 bit 933 MHz FPGA-78 512 M x 8 1.283 V 1.575 V - 40 C + 95 C DDR3(L) Tray
Zentel Japan DRAM DDR3 4Gb, 512Mx8, 2133 at CL14, 1.5V, FBGA-78
Datasheet
Non-Stocked Lead-Time 24 Weeks
Min.: 2.420
Mult.: 2.420

SDRAM - DDR3 4 Gbit 8 bit 1.066 GHz FPGA-78 512 M x 8 1.425 V 1.575 V 0 C + 95 C DDR3 Tray
Zentel Japan DRAM DDR3 4Gb, 512Mx8, 2133 at CL14, 1.5V, FBGA-78, Ind. Temp.
Datasheet
Non-Stocked Lead-Time 28 Weeks
Min.: 2.420
Mult.: 2.420

SDRAM - DDR3 4 Gbit 8 bit 1.066 GHz FPGA-78 512 M x 8 1.425 V 1.575 V - 40 C + 95 C DDR3 Tray
Zentel Japan DRAM DDR3L 4Gb, 512Mx8, 2133 at CL14, 1.35V, FBGA-78
Datasheet
Non-Stocked Lead-Time 24 Weeks
Min.: 2.420
Mult.: 2.420

SDRAM - DDR3L 4 Gbit 8 bit 1.066 GHz FPGA-78 512 M x 8 1.283 V 1.45 V 0 C + 95 C DDR3L Tray
Zentel Japan DRAM DDR3&DDR3L 4Gb, 256Mx16, 1866 at CL13, 1.35V&1.5V, FBGA-96
Datasheet
Non-Stocked Lead-Time 16 Weeks
Min.: 2.090
Mult.: 2.090

SDRAM - DDR3L 4 Gbit 16 bit 933 MHz FPGA-96 256 M x 16 1.283 V 1.575 V 0 C + 95 C DDR3(L) Tray
Zentel Japan DRAM DDR3&DDR3L 4Gb, 256Mx16, 1866 at CL13, 1.35V&1.5V, FBGA-96, Ind. Temp.
Datasheet
Non-Stocked Lead-Time 20 Weeks
Min.: 2.090
Mult.: 2.090

SDRAM - DDR3L 4 Gbit 16 bit 933 MHz FPGA-96 256 M x 16 1.283 V 1.575 V - 40 C + 95 C DDR3(L) Tray
Zentel Japan DRAM DDR3 4Gb, 256Mx16, 2133 at CL14, 1.5V, FBGA-96
Datasheet
Non-Stocked Lead-Time 24 Weeks
Min.: 2.090
Mult.: 2.090

SDRAM - DDR3 4 Gbit 16 bit 1.066 GHz FPGA-96 256 M x 16 1.425 V 1.575 V 0 C + 95 C DDR3 Tray
Zentel Japan DRAM DDR3 4Gb, 256Mx16, 2133 at CL14, 1.5V, FBGA-96, Ind. Temp.
Datasheet
Non-Stocked Lead-Time 28 Weeks
Min.: 2.090
Mult.: 2.090

SDRAM - DDR3 4 Gbit 16 bit 1.066 GHz FPGA-96 256 M x 16 1.425 V 1.575 V - 40 C + 95 C DDR3 Tray
Zentel Japan DRAM DDR3L 4Gb, 256Mx16, 2133 at CL14, 1.35V, FBGA-96
Datasheet
Non-Stocked Lead-Time 24 Weeks
Min.: 2.090
Mult.: 2.090

SDRAM - DDR3L 4 Gbit 16 bit 1.066 GHz FPGA-96 256 M x 16 1.283 V 1.45 V 0 C + 95 C DDR3L Tray
Zentel Japan DRAM DDR3L 8Gb, 1024Mx8 (1CS, 1ZQ), 1600 at CL11, 1.35V, FBGA-78, Ind. Temp.
Datasheet
Non-Stocked Lead-Time 24 Weeks
Min.: 2.200
Mult.: 2.200

Tray
Zentel Japan DRAM DDR3L 8Gb, 512Mx16 (1CS, 1ZQ), 1600 at CL11, 1.35V, FBGA-96
Datasheet
Non-Stocked Lead-Time 24 Weeks
Min.: 1.900
Mult.: 1.900

SDRAM - DDR3L 8 Gbit 16 bit 800 MHz FPGA-96 512 M x 16 1.283 V 1.45 V 0 C + 95 C DDR3L Tray
Zentel Japan DRAM DDR3L 8Gb, 512Mx16 (1CS, 1ZQ), 1600 at CL11, 1.35V, FBGA-96, Ind. Temp.
Datasheet
Non-Stocked Lead-Time 24 Weeks
Min.: 1.900
Mult.: 1.900

Tray
ISSI DRAM Automotive (Tc: -40 to +95C), 2G, 0.57-0.65V/1.06-1.17/1.70-1.95V, LPDDR4X, 128Mx16, 1600MHz, 200 ball BGA (10mmx14.5mm, 1.1mm max thickness) RoHS
Datasheet
Non-Stocked Lead-Time 52 Weeks
Min.: 136
Mult.: 136

SDRAM - LPDDR4X 2 Gbit 16 bit 1.6 GHz BGA-200 128 M x 16 570 mV 650 mV - 40 C + 95 C Tray
ISSI DRAM Automotive (Tc: -40 to +105C), 2G, 0.57-0.65V/1.06-1.17/1.70-1.95V, LPDDR4X, 128Mx16, 1600MHz, 200 ball BGA (10mmx14.5mm, 1.1mm max thickness) RoHS
Datasheet
Non-Stocked Lead-Time 52 Weeks
Min.: 136
Mult.: 136

SDRAM - LPDDR4X 2 Gbit 16 bit 1.6 GHz BGA-200 128 M x 16 570 mV 650 mV - 40 C + 105 C Tray
ISSI DRAM Automotive (Tc: -40 to +95C), 4G, 0.57-0.65V/1.06-1.17/1.70-1.95V, LPDDR4X, 256Mx16, 1600MHz, 200 ball BGA (10mmx14.5mm, 1.1mm max thickness) RoHS
Datasheet
Non-Stocked Lead-Time 52 Weeks
Min.: 136
Mult.: 136

SDRAM - LPDDR4X 16 bit 1.6 GHz BGA-200 256 M x 16 570 mV 650 mV - 40 C + 95 C Tray
ISSI DRAM Automotive (Tc: -40 to +105C), 4G, 0.57-0.65V/1.06-1.17/1.70-1.95V, LPDDR4X, 256Mx16, 1600MHz, 200 ball BGA (10mmx14.5mm, 1.1mm max thickness) RoHS
Datasheet
Non-Stocked Lead-Time 52 Weeks
Min.: 136
Mult.: 136

SDRAM - LPDDR4X 16 bit 1.6 GHz BGA-200 256 M x 16 570 mV 650 mV - 40 C + 105 C Tray
ISSI DRAM Automotive (Tc: -40 to +95C), 4G, 0.57-0.65V/1.06-1.17/1.70-1.95V, LPDDR4X, 128Mx32, 1600MHz, 200 ball BGA (10mmx14.5mm, 1.1mm max thickness) RoHS
Datasheet
Non-Stocked Lead-Time 52 Weeks
Min.: 136
Mult.: 136

SDRAM - LPDDR4X 4 Gbit 32 bit 1.6 GHz BGA-200 128 M x 32 570 mV 650 mV - 40 C + 95 C Tray
ISSI DRAM Automotive (Tc: -40 to +105C), 4G, 0.57-0.65V/1.06-1.17/1.70-1.95V, LPDDR4X, 128Mx32, 1600MHz, 200 ball BGA(10mmx14.5mm, 1.1mm max thickness) RoHS
Datasheet
Non-Stocked Lead-Time 52 Weeks
Min.: 136
Mult.: 136

SDRAM - LPDDR4X 4 Gbit 32 bit 1.6 GHz BGA-200 128 M x 32 570 mV 650 mV - 40 C + 105 C Tray