32 bit Embedded Solutions

Types of Embedded Solutions
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Results: 1.276
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 Mfr.
Description Datasheet Availability Pricing (EUR) Filter the results in the table by unit price based on your quantity.
Qty. RoHS
Nuvoton NK-NUC029L
Nuvoton Development Boards & Kits - ARM An Evaluation/Development Kit for NUC029Lxx
Datasheet
Non-Stocked Lead-Time 8 Weeks
Min.: 13
Mult.: 1
Nuvoton NK-NUC029SG
Nuvoton Development Boards & Kits - ARM An Evaluation/Development Kit for NUC029SGE
Datasheet
Non-Stocked Lead-Time 8 Weeks
Min.: 13
Mult.: 1
Nuvoton NK-NUC1311L
Nuvoton Development Boards & Kits - ARM An Evaluation/Development Kit for NUC1311 series
Datasheet
Non-Stocked Lead-Time 8 Weeks
Min.: 9
Mult.: 1
Unexpected Maker Development Boards & Kits - Wireless TinyC6 ESP32-C6 with u.FL connector
Datasheet
Lead-Time 2 Weeks
Min.: 1
Mult.: 1

ISSI DRAM 512M, 2.5V, Mobile SDRAM, 16Mx32, 133Mhz, 90 ball BGA (8mmx13mm) RoHS, T&R
Datasheet
Non-Stocked Lead-Time 8 Weeks
Min.: 2.500
Mult.: 2.500
: 2.500

ISSI DRAM 512M, 3.3V, Mobile SDRAM, 16Mx32, 133Mhz, 90 ball BGA (8mmx13mm) RoHS, T&R
Datasheet
Non-Stocked Lead-Time 8 Weeks
Min.: 2.500
Mult.: 2.500
: 2.500

ISSI DRAM 512M, 2.5V, Mobile SDRAM, 16Mx32, 133Mhz, 90 ball BGA (8mmx13mm) RoHS
Datasheet
Non-Stocked Lead-Time 8 Weeks
Min.: 240
Mult.: 240

ISSI DRAM 512M, 3.3V, Mobile SDRAM, 16Mx32, 133Mhz, 90 ball BGA (8mmx13mm) RoHS
Datasheet
Non-Stocked Lead-Time 8 Weeks
Min.: 240
Mult.: 240

Toshiba BMSKTOPASA900(DCE)
Toshiba Development Boards & Kits - ARM KIT STARTER TMPA900 USB JTAG Non-Stocked
Min.: 1
Mult.: 1

Toshiba BMSKTOPASA910(DCE)
Toshiba Development Boards & Kits - ARM TOPAX STARTER KIT TMPA910CRAXBG Non-Stocked
Min.: 1
Mult.: 1

NXP Semiconductors S32K388CVB-Q289
NXP Semiconductors Development Boards & Kits - ARM S32K388 - Validation Board Non-Stocked Lead-Time 53 Weeks
Min.: 1
Mult.: 1

NXP Semiconductors M9328MX1ADS/B
NXP Semiconductors Development Boards & Kits - ARM I.MX1 ADS WITH LCD AND IMAGICSENSOR Non-Stocked Lead-Time 15 Weeks
Min.: 1
Mult.: 1
No
SparkFun Development Boards & Kits - ARM The SparkFun moto:bit is a fully loaded "carrier" board for the micro:bit that when combined with the micro:bit provides you with a fully functional robotics platform. The moto:bit offers a simple beginner-friendly robotics controller capable of o Non-Stocked
Min.: 1
Mult.: 1
ZiLOG Development Boards & Kits - Other Processors Z8F1680 Dual 44-Pin Series
Datasheet
Non-Stocked
Min.: 1
Mult.: 1

ISSI DRAM Automotive (Tc: -40 to +95C), 4G, 1.06-1.17/1.70-1.95V, LPDDR4, 128Mx32, 1600MHz, 200 ball BGA (10mmx14.5mm, 1.1mm max thickness) RoHS, T&R
Datasheet
Non-Stocked Lead-Time 52 Weeks
Min.: 2.500
Mult.: 2.500
: 2.500

ISSI DRAM Automotive (Tc: -40 to +105C), 4G, 1.06-1.17/1.70-1.95V, LPDDR4, 128Mx32, 1600MHz, 200 ball BGA (10mmx14.5mm, 1.1mm max thickness) RoHS, T&R
Datasheet
Non-Stocked Lead-Time 52 Weeks
Min.: 2.500
Mult.: 2.500
: 2.500

ISSI DRAM Automotive (Tc: -40 to +95C), 4G, 0.57-0.65V/1.06-1.17/1.70-1.95V, LPDDR4X, 128Mx32, 1600MHz, 200 ball BGA (10mmx14.5mm, 1.1mm max thickness) RoHS
Datasheet
Non-Stocked Lead-Time 52 Weeks
Min.: 136
Mult.: 136

ISSI DRAM Automotive (Tc: -40 to +95C), 4G, 0.57-0.65V/1.06-1.17/1.70-1.95V, LPDDR4X, 128Mx32, 1600MHz, 200 ball BGA (10mmx14.5mm, 1.1mm max thickness) RoHS, T&R
Datasheet
Non-Stocked Lead-Time 52 Weeks
Min.: 2.500
Mult.: 2.500
: 2.500

ISSI DRAM Automotive (Tc: -40 to +105C), 4G, 0.57-0.65V/1.06-1.17/1.70-1.95V, LPDDR4X, 128Mx32, 1600MHz, 200 ball BGA(10mmx14.5mm, 1.1mm max thickness) RoHS
Datasheet
Non-Stocked Lead-Time 52 Weeks
Min.: 136
Mult.: 136

ISSI DRAM 4G, 0.57-0.65V/1.06-1.17/1.70-1.95V, LPDDR4X, 128Mx32, 1600MHz, 200 ball BGA (10mmx14.5mm, 1.1mm max thickness) RoHS, T&R
Datasheet
Non-Stocked Lead-Time 52 Weeks
Min.: 2.500
Mult.: 2.500
: 2.500

ISSI DRAM Automotive (Tc: -40 to +105C), 4G, 0.57-0.65V/1.06-1.17/1.70-1.95V, LPDDR4X, 128Mx32, 1600MHz, 200 ball BGA (10mmx14.5mm, 1.1mm max thickness) RoHS, T&R
Datasheet
Non-Stocked
Min.: 2.500
Mult.: 2.500

ISSI DRAM 512M, 2.5V, Mobile SDRAM, 16Mx32, 133Mhz, 90 ball BGA (8mmx13mm) RoHS, IT, T&R
Datasheet
Non-Stocked Lead-Time 52 Weeks
Min.: 2.500
Mult.: 2.500
: 2.500

ISSI DRAM 256M, 2.5V, Mobile SDRAM, 8Mx32, 133Mhz, 90 ball BGA (8mmx13mm) RoHS, IT, T&R
Datasheet
Non-Stocked Lead-Time 52 Weeks
Min.: 2.500
Mult.: 2.500
: 2.500

ISSI DRAM 512M, 3.3V, SDRAM, 16Mx32, 166MHz, 90 ball BGA (8mmx13mm) RoHS, IT, T&R
Datasheet
Non-Stocked Lead-Time 52 Weeks
Min.: 2.500
Mult.: 2.500
: 2.500

ISSI DRAM 512M, 3.3V, SDRAM, 16Mx32, 166MHz, 90 ball BGA (8mmx13mm) RoHS, T&R
Datasheet
Non-Stocked Lead-Time 52 Weeks
Min.: 2.500
Mult.: 2.500
: 2.500