All Results (656)

Computer-On-Modules - COM COM HPC Size A module with Intel Celeron 6305E Processor, dual core with 1.8GHz, 4MB L2 cache, GT48 graphics and 3200MT/s dual channel DDR4 memory interface (15W TDP).

CPU & Chip Coolers Standard active cooling solution for high performance COM-HPC module conga-HPC/cTLUwith integrated heatpipe, 29mm height and integrated 12V fan. All standoffs are with 2.7mm bore hole.

CPU & Chip Coolers Standard passive cooling solution for high performance COM-HPC module conga-HPC/cTLUwith integrated heatpipe, 28mm height. All standoffs are with M2.5mm thread.

Computer-On-Modules - COM COM Express Type 6 Basic module based on Intel Core i7-11850HE 8-core processor with 2.6GHz up to 4.7GHz turbo boost, 24MB Intel Smart Cache, Intel UHD Graphics and dual channel DDR4 3200 MT/s memory interface (formerly Tiger Lake-H) with Chipset

Computer-On-Modules - COM COM Express Type 6 Basic module based on Intel Core i3-11100HE 4-core processor with 2.4GHz up to 4.4GHz turbo boost, 8MB Intel Smart Cache, Intel UHD Graphics and dual channel DDR4 3200 MT/s memory interface (formerly Tiger Lake-H) with Chipset

Computer-On-Modules - COM COM Express Type 6 Basic module based on Intel Xeon Processor W-11865MRE 8-core processor with 2.6GHz up to 4.7GHz turbo boost, 24MB Intel Smart Cache, Intel UHD Graphics and dual channel DDR4 3200 MT/s memory interface (formerly Tiger Lake-H) wi

Computer-On-Modules - COM COM Express Type 6 Basic module based on Intel Xeon Processor W-11155MRE 4-core processor with 2.4GHz up to 4.4GHz turbo boost, 8MB Intel Smart Cache, Intel UHD Graphics and dual channel DDR4 3200 MT/s memory interface (formerly Tiger Lake-H) wit

Computer-On-Modules - COM COM Express Type 6 Basic module based on Intel Xeon Processor W-11555MLE 6-core processor with 1.9GHz up to 4.4GHz turbo boost, 12MB Intel Smart Cache, Intel UHD Graphics and dual channel DDR4 3200 MT/s memory interface (formerly Tiger Lake-H) wi

CPU & Chip Coolers Standard active cooling solution for high performance COM Express module conga-TS570 with integrated heat pipes, 29mm overall heat sink height and integrated 12V fan. All standoffs are with 2.7mm bore hole.

CPU & Chip Coolers Standard passive cooling solution for high performance COM Express module conga-TS570 with integrated heat pipes, 28mm overall heat sink height. All standoffs are with 2.7mm bore hole.

Heat Sinks Standard heatspreader for high performance COM Express module conga-TS570 with integrated heat pipes, 11mm overall heat sink height. All standoffs are with 2.7mm bore hole.

Computer-On-Modules - COM COM-HPC client module based on Intel Core i7-11850HE 8-core processor with 2.6GHz up to 4.7GHz turbo boost, 24MB Intel Smart Cache, Intel UHD Graphics and dual channel DDR4 3200 MT/s memory interface (formerly Tiger Lake-H) with Chipset QM580E.