Renesas / Dialog RF System on a Chip - SoC

Results: 33
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Description Datasheet Availability Pricing (EUR) Filter the results in the table by unit price based on your quantity.
Qty. RoHS ECAD Model Type
Core
Operating Frequency
Maximum Data Rate
Output Power
Sensitivity
Supply Voltage - Min
Supply Voltage - Max
Supply Current Receiving
Supply Current Transmitting
Program Memory Size
Minimum Operating Temperature
Maximum Operating Temperature
Package/Case
Packaging
Renesas / Dialog RF System on a Chip - SoC Bluetooth Low Energy 4.2 SoC with Flexpower ARM Cortex M0, crypto, PMU, memories and peripherals - 37 GPIOs in AQFN60 package and 0.55mm pin pitch
Datasheet
Non-Stocked Lead-Time 18 Weeks
Min.: 4.000
Mult.: 4.000
Reel: 4.000

Bluetooth ARM Cortex M0 2.4 GHz 0 dBm - 94 dBm 1.7 V 4.75 V 3.1 mA 3.4 mA 64 kB AQFN-60 Reel
Renesas / Dialog DA14585-00T00AT2
Renesas / Dialog RF System on a Chip - SoC Bluetooth Low Energy 5.0 SoC with integrated ARM Cortex M0, PMU, memories, voice interface and peripherals, 105degC ? 25 GPIOsin QFN40 and 0.4mm pin pitch package
Datasheet
Non-Stocked Lead-Time 18 Weeks
Min.: 5.000
Mult.: 5.000
Reel: 5.000

BLE 5.0 QFN-40 Reel
Renesas / Dialog DA14530-00000FX2
Renesas / Dialog RF System on a Chip - SoC Bluetooth Low Energy 5.1 SoC with integrated ARM Cortex M0+, memories and peripherals ? 12 GPIOs in FCGQFN24 and 0.4mm ball pitch package
Datasheet
Non-Stocked Lead-Time 18 Weeks
Min.: 1
Mult.: 1
Reel: 4.000

Bluetooth 5.1 ARM Cortex M0+ 2.4 GHz 1 Mbps 2.5 dBm - 94 dBm 1.8 V 3.3 V 5 mA 9 mA 32 kB - 40 C + 85 C FCGQFN-24 Reel, Cut Tape
Renesas / Dialog DA14531-01000FX2
Renesas / Dialog RF System on a Chip - SoC Bluetooth Low Energy 5.1 SoC with integrated ARM Cortex M0+, memories and peripherals ? 12 GPIOs in FCGQFN24 and 0.4mm ball pitch package
Datasheet
Non-Stocked Lead-Time 18 Weeks
Min.: 4.000
Mult.: 4.000
Reel: 4.000

Bluetooth 5.1 ARM Cortex M0+ 2.4 GHz 1 Mbps 2.5 dBm - 94 dBm 1.8 V 3.6 V 2.2 mA 3.5 mA 32 kB - 40 C + 85 C FCGQFN-24 Reel
Renesas / Dialog DA14531-01000OG2
Renesas / Dialog RF System on a Chip - SoC Bluetooth Low Energy 5.1 SoC with integrated ARM Cortex M0+, memories and peripherals ? 6 GPIOs in WL-CSP17 and 0.5mm ball pitch package
Datasheet
Non-Stocked Lead-Time 18 Weeks
Min.: 4.000
Mult.: 4.000
Reel: 4.000

Bluetooth 5.1 ARM Cortex M0+ 2.4 GHz 1 Mbps 2.5 dBm - 94 dBm 1.8 V 3.6 V 2.2 mA 3.5 mA 32 kB - 40 C + 85 C WLCSP-17 Reel
Renesas / Dialog DA14701-00000HZ2
Renesas / Dialog RF System on a Chip - SoC Multi-core wireless MCU for Bluetooth 5.2 and proprietary 2G4 protocols
Datasheet
Non-Stocked Lead-Time 18 Weeks
Min.: 4.000
Mult.: 4.000
Reel: 4.000

Bluetooth 5.2 ARM Cortex M33 2.4 GHz 2 Mbps 6 dBm - 97 dBm 2.9 V 4.75 V 1.85 mA 3 mA 4 kB - 40 C + 85 C VFBGA-142 Reel
Renesas / Dialog DA14705-00000HZ2
Renesas / Dialog RF System on a Chip - SoC Multi-core wireless MCU for Bluetooth 5.2 and proprietary 2G4 protocols
Datasheet
Non-Stocked Lead-Time 18 Weeks
Min.: 4.000
Mult.: 4.000
Reel: 4.000

Bluetooth 5.2 ARM Cortex M33 2.4 GHz 2 Mbps 6 dBm - 97 dBm 2.9 V 4.75 V 1.85 mA 3 mA 4 kB - 40 C + 85 C VFBGA-142 Reel
Renesas / Dialog DA14708-00000HZ2
Renesas / Dialog RF System on a Chip - SoC Multi-core wireless MCU for Bluetooth 5.2 and proprietary 2G4 protocols
Datasheet
Non-Stocked Lead-Time 18 Weeks
Min.: 4.000
Mult.: 4.000
Reel: 4.000

Bluetooth 5.2 ARM Cortex M33 2.4 GHz 2 Mbps 6 dBm - 97 dBm 2.9 V 4.75 V 1.85 mA 3 mA 4 kB - 40 C + 85 C VFBGA-142 Reel