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012-80-488/020

Name: Amphenol 012-80-488/020
Brand: Amphenol / SV Microwave
SKU: 523-012-80-488/020
Price: 25.75 EUR
Availability: InStock

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Mouser No:

523-012-80-488/020

Mfr. No:

012-80-488/020

Mfr.:

Amphenol / SV Microwave

Description:

RF Connector Accessories 3mm Male Thread-In Shroud, FD

Datasheet:

012-80-488/020 Datasheet (PDF)

ECAD Model:

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More Information

Learn more about Amphenol / SV Microwave 012-80-488/020

In Stock: 66

Stock:: 66 Can Dispatch Immediately

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Factory Lead Time:: 14 Weeks Estimated factory production time for quantities greater than shown.

Quantities greater than 66 will be subject to minimum order requirements.

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Minimum: 1 Multiples: 1

Unit Price:

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Ext. Price:

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Est. Tariff:

Pricing (EUR)

Qty.	Unit Price	Ext. Price
	25,75 €	25,75 €
	25,55 €	255,50 €
	24,24 €	484,80 €
	23,37 €	1.168,50 €

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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	Amphenol
Product Category:	RF Connector Accessories
RoHS:
REACH - SVHC:
Body Finish:	Passivated
Body Material:	Stainless Steel
Product:	PCB Terminators
Packaging:	Tray
Brand:	Amphenol / SV Microwave
Country of Assembly:	Not Available
Country of Diffusion:	Not Available
Country of Origin:	US
Frequency Range:	40 GHz
Gender:	Plug (Male)
Impedance:	50 Ohms
Maximum Frequency:	40 GHz
Product Type:	RF Connector Accessories
Series:	3mm
Factory Pack Quantity:	100
Subcategory:	RF Interconnects
Unit Weight:	50,585 g

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Datasheet

012-80-488/020 Datasheet (PDF)

Application Notes

App Note

Models

CNHTS:: 8536690000
CAHTS:: 8536690010
USHTS:: 8538908180
JPHTS:: 853669000
MXHTS:: 85366999
BRHTS:: 85366990
ECCN:: EAR99

3mm Board-to-Board Interconnects

Amphenol SV Microwave 3mm Board-to-Board Interconnects feature 3mm board-to-board spacing and a minimum pitch of .150" between adjacent connectors. These connectors offer a DC to 40GHz frequency range. The series provides the lowest stacked height of any board-to-board high-frequency coaxial connection system. Amphenol SV Microwave 3mm Board-to-Board Interconnects are ideal for use in embedded computing, high-density stacked PCB applications, and high-density multiport applications.