MI1210K600R-10

Laird Technologies
875-MI1210K600R-10
MI1210K600R-10

Mfr.:

Description:
Ferrite Beads 60ohms 100MHz 1.5A Monolithic 1210 SMD

ECAD Model:
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In Stock: 146

Stock:
146
Can Dispatch Immediately
On Order:
15.000
Expected 6/1/2026
Factory Lead Time:
9
Weeks Estimated factory production time for quantities greater than shown.
Minimum: 1   Multiples: 1
Unit Price:
-,-- €
Ext. Price:
-,-- €
Est. Tariff:
Packaging:
Full Reel (Order in multiples of 3000)

Pricing (EUR)

Qty. Unit Price
Ext. Price
Cut Tape / MouseReel™
0,249 € 0,25 €
0,174 € 1,74 €
0,151 € 3,78 €
0,135 € 6,75 €
0,12 € 12,00 €
0,102 € 25,50 €
0,10 € 100,00 €
Full Reel (Order in multiples of 3000)
0,10 € 300,00 €
† A MouseReel™ fee of 5,00 € will be added and calculated in your basket. All MouseReel™ orders are non-cancellable and non-returnable.

Product Attribute Attribute Value Select Attribute
Laird Technologies
Product Category: Ferrite Beads
RoHS:  
MI
Ferrite Chip Beads
SMD/SMT
1210 (3225 metric)
60 Ohms
1.5 A
35 mOhms
- 40 C
+ 125 C
3.2 mm
2.5 mm
1.4 mm
Reel
Cut Tape
MouseReel
Brand: Laird Technologies
Product Type: Ferrite Beads
Factory Pack Quantity: 3000
Subcategory: Ferrites
Test Frequency: 100 MHz
Type: Differential Mode Ferrite Chip Bead Power
Unit Weight: 16 mg
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Attributes selected: 0

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TARIC:
8504901110
CNHTS:
8548000001
CAHTS:
8548000000
USHTS:
8548000000
JPHTS:
854800000
MXHTS:
85049099
ECCN:
EAR99

Inductive Components

Laird Technologies provides a wide range of inductive components that satisfy multiple design requirements in power systems. Inductive components are a standard set of components in power electronics used in filtering and power regulation. Various inductive components are found in power regulation or power conversion systems, and each component has to be selected such that it helps achieve low-noise, precise regulation, and required isolation to prevent unintended coupling. This broad line of components from Laird helps designers create a custom, flexible solution that addresses multiple EMI problems in power systems without compromising form factor or excessive use of shielding materials.