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FGA66XABMD

Name: Quectel FGA66XABMD
Brand: Quectel
SKU: 277-FGA66XABMD
Price: 11.57 EUR
Availability: OutOfStock

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See Product Specifications

Mouser No:

277-FGA66XABMD

Mfr. No:

FGA66XABMD

Mfr.:

Quectel

Description:

Multiprotocol Modules Wi-Fi 6 (2.4GHz/5GHz), ?IEEE 802.11a/b/g/n/ac/ax, BLE 5.4, Thread 802.15.4, Antenna 1 1 (1T1R), 2 antennas, Wi-Fi application: SDIO 3.0, -40C +85C

Lifecycle:

New Product:

New from this manufacturer.

Datasheet:

FGA66XABMD Datasheet (PDF)

ECAD Model:

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More Information

Learn more about Quectel FGA66XABMD

Availability

Stock:: 0

You can still purchase this product for backorder.

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On Order:: 100

Expected 9/11/2026
Factory Lead Time:: 32

Weeks Estimated factory production time for quantities greater than shown.

Long lead time reported on this product.

Enter Quantity:

Minimum: 1 Multiples: 1

Unit Price:

-,-- €

Ext. Price:

-,-- €

Est. Tariff:

Pricing (EUR)

Qty.	Unit Price	Ext. Price
	11,57 €	11,57 €
	10,05 €	100,50 €
	9,53 €	238,25 €
	8,82 €	882,00 €
	8,38 €	2.095,00 €
Full Reel (Order in multiples of 500)
	8,08 €	4.040,00 €

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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	Quectel
Product Category:	Multiprotocol Modules
Frequency:	2.4 GHz, 5 GHz
Interface Type:	SPI, UART, USB
Supply Voltage - Min:	3.14 V
Supply Voltage - Max:	3.46 V
Minimum Operating Temperature:	- 40 C
Maximum Operating Temperature:	+ 85 C
Antenna Connector Type:	PCB Antenna
Dimensions:	23 mm x 14 mm x 2.2 mm
Protocol - Bluetooth, BLE - 802.15.1:	BLE 5.4
Protocol - WiFi - 802.11:	802.11 a/b/g/n/ac/ax
Packaging:	Reel
Packaging:	Cut Tape
Brand:	Quectel
Data Rate:	114.7 Mb/s
Modulation Technique:	DSSS/ OFDM/ DBPSK/ DQPSK/ CCK/ BPSK/ QPSK/ 16QAM/ 64QAM/ 256QAM
Mounting Style:	SMD/SMT
Operating Supply Voltage:	3.3 V
Product Type:	Multiprotocol Modules
Factory Pack Quantity:	500
Subcategory:	Wireless & RF Modules
Type:	Wi-Fi 6, BLE 5.4

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Datasheet

FGA66XABMD Datasheet (PDF)

Origin Classifications

Country of Origin:: China
Assembly Country of Origin:: Not available
Country of Diffusion:: Not available

The country is subject to change at the time of shipment.

FGA66X Wi-Fi 6, BLE 5.4 & IEEE 802.15.4 Modules

Quectel FGA66X Wi-Fi 6, BLE 5.4, and IEEE 802.15.4 Modules are high-performance modules in an LGA package and support the IEEE 802.11ax standard protocol. These modules operate at MCS 0 to MCS 9 rates over a 20MHz bandwidth and 256QAM. The FGA66X modules are designed with a reliable SDIO 3.0 and USB interface to provide WLAN capability. The low profile and small size of the LGA package enable the modules to be easily embedded in size-constrained applications and to provide reliable connectivity. The FGA66X modules are available in an ultra-compact size of 23mm x 14mm x 2.2mm to meet the demands of size-sensitive applications. These modules operate over a wide temperature range of -40°C to 85°C and are available in an LGA package. The FGA66X modules are ideal for a variety of smart home and industrial applications.