Q870I-IM-A

Asus
47-Q870I-IM-A
Q870I-IM-A

Mfr.:

Description:
Industrial Motherboards Mini-ITX motherboard with New LGA 1851 Socket for Intel Core Ultra Processors, Q870 Chipset, 2*DDR5 SO-DIMM slots, PCIe Gen 5.0, DP, HDMI, USB TypeC (DP-alt)

Lifecycle:
New Product:
New from this manufacturer.
Mouser does not presently sell this product in your region.

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Product Attribute Attribute Value Select Attribute
Asus
Product Category: Industrial Motherboards
Delivery Restrictions:
 Mouser does not presently sell this product in your region.
RoHS:  
Mini-IX
Q870
ARL-S
DDR5 SO-DIMM
2 Channel
6.4 GHz
2 x DP 1.4, 1 x USB Type C, 1 x HDMI 2.1,
4 x SATA
RAID 0,1,5,10
1 x PCIe 5.0 x 16 Slot, 1 x M.2 E key, 1 x M.2 M key
7 Port
1 Port
0 C
+ 60 C
Brand: Asus
Core: ARL-S Core Ultra 9/7/5
Dimensions: 170 mm x 170 mm
Frequency: 6.4 GHz
Interface Type: PCIe, SPI, USB
Memory Size: 96 GB
Number of Cores: 1 Core
Number of SATA Ports: 4 Port
Packaging: Bulk
Processor Brand: Intel
Product: Motherboards
Product Type: Industrial Motherboards
Factory Pack Quantity: 1
Subcategory: Development Tools
TDP - Max: 65W TDP
Part # Aliases: 90ME0A40-M0UCY0
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Q870I-IM-A Industrial Motherboard

Asus Q870I-IM-A Industrial Motherboard is a high-performance industrial Mini-ITX motherboard designed for space-constrained embedded applications that demand robust computing power and rich connectivity. Built on the Intel® Q870 chipset, the Asus Q870I-IM-A supports 12th- and 13th-Gen Intel Core processors, delivering desktop-grade performance for industrial workloads. A compact form factor makes the motherboard ideal for use in smart manufacturing, healthcare, retail, and transportation systems. The board features dual 2.5Gb Ethernet ports, multiple COM and USB ports, and support for triple independent displays, including dual 4K outputs. With industrial-grade reliability, extended lifecycle support, and wide-ranging I/O, the Q870I-IM-A is well-suited for edge AI systems, kiosks, digital signage, and other embedded solutions requiring high-speed data processing and connectivity in a compact footprint.