EasyPACK™ TRENCHSTOP™ IGBT7 Modules

Infineon Technologies EasyPACK™ TRENCHSTOP™ IGBT7 Modules are based on micro-pattern trenches technology. This provides reduced losses and offers a high level of controllability. The chip is specially optimized for industrial drive applications. The modules offer lower static losses, higher power density, and softer switching. A significant increase in power density can be obtained by raising the allowed maximum operation temperature up to 175°C in the power module.

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Infineon Technologies Infineon EasyPACK module with TRENCHSTOPIGBT7 and emitter controlled 7 diode and PressFIT / NTC
Datasheet
30In Stock
Min.: 1
Mult.: 1

Infineon Technologies IGBT Modules 950 V 400 A EasyPACK module with TRENCHSTOP IGBT7 and CoolSiC Schottky diode
Datasheet
23In Stock
Min.: 1
Mult.: 1

Infineon Technologies IGBT Modules 1200 V, 25 A sixpack IGBT module
Datasheet
2In Stock
Min.: 1
Mult.: 1

Infineon Technologies IGBT Modules 1200 V, 35 A sixpack IGBT module
Datasheet
26In Stock
Min.: 1
Mult.: 1

Infineon Technologies IGBT Modules 1200 V, 50 A sixpack IGBT module
Datasheet
15In Stock
Min.: 1
Mult.: 1

Infineon Technologies F3L400R10W3S7FB11BPSA1
Infineon Technologies IGBT Modules 950 V, 400 A 3-level IGBT module
Datasheet
1In Stock
Min.: 1
Mult.: 1
Infineon Technologies FS3L200R10W3S7FB11BPSA1
Infineon Technologies IGBT Modules 950 V, 200 A 3-level IGBT module
Datasheet
9In Stock
Min.: 1
Mult.: 1