TS391 No-Clean Solder Paste

Chip Quik TS391 No-Clean Solder Paste is a dispense grade, synthetic paste with no refrigeration required to maintain shelf life. The no-clean solder paste provides excellent wetting compatibility on most board finishes, exhibiting a wide process window with low voiding and long stencil life. Chip Quik TS391 solder paste leaves a clear residue and supports printing speeds up to 125mm/sec. This solder paste is available with three different alloy compositions, each with different melting points, in 15g, 35g, 50g, 250g, and 500g packaging. The RoHS II and REACH compliant paste features a T4 mesh size, 20µm to 38µm range, and a ROL0 flux classification.

Results: 15
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Description Datasheet Availability Pricing (EUR) Filter the results in the table by unit price based on your quantity.
Qty. RoHS Product
Type
Alloy
Package Type
Chip Quik Solder Paste No-Clean 15g Sn63/Pb37 T4
Datasheet
555In Stock
Min.: 1
Mult.: 1
Solder Paste Tin/Lead, No Clean, Thermally Stable Sn63/Pb37 Syringe
Chip Quik Solder Paste No-Clean 35g Sn63/Pb37 T4
Datasheet
149In Stock
324Expected 6/15/2026
Min.: 1
Mult.: 1
Solder Paste Tin/Lead, No Clean, Thermally Stable Sn63/Pb37 Syringe
Chip Quik Solder Paste No-Clean 250g Sn63/Pb37 T4
Datasheet
69In Stock
117Expected 7/27/2026
Min.: 1
Mult.: 1
Solder Paste Tin/Lead, No Clean, Thermally Stable Sn63/Pb37 Jar
Chip Quik Solder Paste No-Clean 50g Sn63/Pb37 T4
Datasheet
333In Stock
Min.: 1
Mult.: 1
Solder Paste Tin/Lead, No Clean, Thermally Stable Sn63/Pb37 Jar
Chip Quik Solder Paste NoClean 15g Sn42/Bi57.6/Ag0.4 T4
Datasheet
146In Stock
294Expected 7/6/2026
Min.: 1
Mult.: 1

Solder Paste Lead Free, No Clean, Thermally Stable Sn42/Bi57.6/Ag0.4 Syringe
Chip Quik Solder Paste NoClean 35g Sn42/Bi57.6/Ag0.4 T4
Datasheet
70In Stock
123Expected 7/6/2026
Min.: 1
Mult.: 1

Solder Paste Lead Free, No Clean, Thermally Stable Sn42/Bi57.6/Ag0.4 Syringe
Chip Quik Solder Paste NoClean 250g Sn42/Bi57.6/Ag0.4 T4
Datasheet
32In Stock
54Expected 7/6/2026
Min.: 1
Mult.: 1

Solder Paste Lead Free, No Clean, Thermally Stable Sn42/Bi57.6/Ag0.4 Jar
Chip Quik Solder Paste No-Clean 50g Sn42/Bi57.6/Ag0.4 T4
Datasheet
126In Stock
Min.: 1
Mult.: 1

Solder Paste Lead Free, No Clean, Thermally Stable Sn42/Bi57.6/Ag0.4 Jar
Chip Quik Solder Paste NoClean 15g T4 Sn96.5/Ag3.0/Cu0.5
Datasheet
204In Stock
Min.: 1
Mult.: 1

Solder Paste Lead Free, No Clean, Thermally Stable Sn96.5/Ag03/Cu0.5 Syringe
Chip Quik Solder Paste NoClean 35g T4 Sn96.5/Ag3.0/Cu0.5
Datasheet
81In Stock
Min.: 1
Mult.: 1

Solder Paste Lead Free, No Clean, Thermally Stable Sn96.5/Ag03/Cu0.5 Syringe
Chip Quik Solder Paste NoCln 250g T4 Sn96.5/Ag3.0/Cu0.5
Datasheet
151In Stock
281Expected 8/5/2026
Min.: 1
Mult.: 1

Solder Paste Lead Free, No Clean, Thermally Stable Sn96.5/Ag03/Cu0.5 Jar
Chip Quik Solder Paste NoClean 50g T4 Sn96.5/Ag3.0/Cu0.5
Datasheet
252In Stock
Min.: 1
Mult.: 1

Solder Paste Lead Free, No Clean, Thermally Stable Sn96.5/Ag03/Cu0.5 Jar
Chip Quik Solder Paste No-Clean 500g Sn63/Pb37 T4
Datasheet
9Expected 6/29/2026
Min.: 1
Mult.: 1
Solder Paste Tin/Lead, No Clean, Thermally Stable Sn63/Pb37 Cartridge
Chip Quik Solder Paste No-Clean 500g Sn42/Bi57.6/Ag0.4 T4
Datasheet
Non-Stocked Lead-Time 6 Weeks
Min.: 1
Mult.: 1

Solder Paste Lead Free, No Clean, Thermally Stable Sn42/Bi57.6/Ag0.4 Cartridge
Chip Quik Solder Paste NoCln 500g T4 Sn96.5/Ag3.0/Cu0.5
Datasheet
N/A
Min.: 1
Mult.: 1

Solder Paste Lead Free, No Clean, Thermally Stable Sn96.5/Ag03/Cu0.5 Cartridge