Trench 650V to 1200V XPT™ GenX4™ IGBTs

IXYS Trench 650V to 1200V XPT™ GenX4™ IGBTs are developed using a proprietary XPT thin-wafer technology and a state-of-the-art 4th generation (GenX4™) trench IGBT process. These insulated-gate bipolar transistors feature reduced thermal resistance, low energy losses, fast switching, low tail current, and high current densities. The devices exhibit exceptional ruggedness during switching and under short-circuit conditions.

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Description Datasheet Availability Pricing (EUR) Filter the results in the table by unit price based on your quantity.
Qty. RoHS ECAD Model Technology
Package/Case
Mounting Style
Configuration
Collector- Emitter Voltage VCEO Max
Collector-Emitter Saturation Voltage
Maximum Gate Emitter Voltage
Continuous Collector Current at 25 C
Pd - Power Dissipation
Minimum Operating Temperature
Maximum Operating Temperature
Series
Packaging
IXYS IGBTs 650V/290A Trench IGBT GenX4 XPT
Datasheet
Non-Stocked Lead-Time 41 Weeks
Min.: 300
Mult.: 25

Si TO-264-3 Through Hole Single 650 V 1.7 V - 20 V, 20 V 290 A 940 W - 55 C + 175 C Trench Tube

IXYS IGBTs 650V/240A TRENCH IGBT GENX4 XPT
Datasheet
Non-Stocked Lead-Time 27 Weeks
Min.: 1
Mult.: 1

Si TO-247-3 Through Hole Single 650 V 2.1 V - 20 V, 20 V 250 A 880 W - 55 C + 175 C Trench Tube

IXYS IGBTs 650V/290A TRENCH IGBT GENX4 XPT
Datasheet
Non-Stocked Lead-Time 48 Weeks
Min.: 300
Mult.: 30

Si TO-247-3 Through Hole Single 650 V 2.1 V - 20 V, 20 V 290 A 940 W - 55 C + 175 C Trench Tube