Server Applications

Bergquist Company Server Applications feature thermal management products designed for a wide range of use — from a few servers in a closet to thousands of them in a data center. No matter the number of servers, a slight reduction in heat or improvement in component performance can significantly impact infrastructure operation. Bergquist Company offers advanced materials for use throughout a circuit board, helping to optimize performance and the corresponding network.

Results: 84
Select Image Part # Mfr. Description Datasheet Availability Pricing (EUR) Filter the results in the table by unit price based on your quantity. Qty. RoHS ECAD Model Product Type Package/Case Material Thermal Conductivity Breakdown Voltage Color Minimum Operating Temperature Maximum Operating Temperature Length Width Thickness Tensile Strength Flammability Rating Series Packaging
Bergquist Company Thermal Interface Products Non-Stocked Lead-Time 16 Weeks
Min.: 11
Mult.: 1

Non-standard 300G / THF 1600G
Bergquist Company 2605474
Bergquist Company Thermal Interface Products Conductive, 1-Part, Liquid Formable Gel, 6.0 W/m-K Non-Stocked Lead-Time 8 Weeks
Min.: 80
Mult.: 1

TLF 6000HG
Bergquist Company TLF6000HG-00-00-8G FLEX
Bergquist Company Thermal Interface Products Conductive, 1-Part, Liquid Formable Gel, 6.0 W/m-K Non-Stocked Lead-Time 8 Weeks
Min.: 25
Mult.: 1

TLF 6000HG
Bergquist Company 2624538
Bergquist Company Thermal Interface Products Conductive, 1-Part, Liquid Formable Gel, 6.0 W/m-K, KG, Liqui-Form TLF 6000HG Non-Stocked Lead-Time 8 Weeks
Min.: 829.188
Mult.: 1

TLF 6000HG
Bergquist Company TLF600HG00-00-300CC
Bergquist Company Thermal Interface Products Conductive, 1-Part, Liquid Formable Gel, 6.0 W/m-K Non-Stocked Lead-Time 8 Weeks
Min.: 3
Mult.: 1

TLF 6000HG
Bergquist Company TLF6000HG-00-00-300CC
Bergquist Company Thermal Interface Products Conductive, 1-Part, Liquid Formable Gel, 6.0 W/m-K Non-Stocked Lead-Time 8 Weeks
Min.: 2.870
Mult.: 1

TLF 6000HG
Bergquist Company 2746333
Bergquist Company Thermal Interface Products GAP PAD, Conductive, Reinforced, Soft S-Class Gap Fill, 3.0 W/m-K Non-Stocked Lead-Time 15 Weeks
Min.: 9
Mult.: 1

3000ULM / TGP 3000ULM
Bergquist Company Thermal Interface Products GAP PAD, 12W/m-K, Ultra-Low Modulus, 8"x8" Sheet, 0.100" Thickness, TGP12000ULM 20In Stock
16On Order
Min.: 2
Mult.: 1

Gap Fillers / Gap Pads / Sheets Thermal Pad Non-standard Silicone 12 W/m-K 6.2 kVAC Gray - 60 C + 200 C 203.2 mm 203.2 mm 2.54 mm 15 psi UL 94 V-0 TGP 12000ULM
Bergquist Company Thermal Interface Products Thermally Conductive Gel Interface Material, 10 W/m-K, 150ml Cartridge Drop Dispatch Lead Time 30 Weeks
Min.: 1
Mult.: 1

Gap Fillers / Gap Pads / Sheets Thermal Gel Silicone Elastomer 10 W/m-K Red - 60 C + 200 C UL 94 V-0 TLF 10000
Bergquist Company Thermal Interface Products GAP PAD, 12 W/m-K, Ultra-Low Modulus, 8" x 8" Sheet, 0.040" Thickness Drop Dispatch Lead Time 19 Weeks
Min.: 5
Mult.: 1

Gap Fillers / Gap Pads / Sheets Gap Filler Silicone 12 W/m-K 6.2 kVAC Gray - 60 C + 200 C 8 in 8 in 0.157 in UL 94 V-0 TGP 12000ULM
Bergquist Company Thermal Interface Products GAP PAD, 10W/m-K, 8" x 8" Sheet, 0.100" Thickness, TGP10000ULM, IDH 2599712 Drop Dispatch Lead Time 8 Weeks
Min.: 2
Mult.: 1

Gap Fillers / Gap Pads / Sheets Thermal Pad Non-standard Silicone 10 W/m-K 3.2 kVAC Gray - 60 C + 200 C 203.2 mm 203.2 mm 2.54 mm 25 psi UL 94 V-0 TGP 10000ULM
Bergquist Company Thermal Interface Products GAP PAD, 12 W/m-K, Ultra-Low Modulus, 8" x 8" Sheet, 0.140" Thickness Drop Dispatch Lead Time 11 Weeks
Min.: 2
Mult.: 1

Gap Fillers / Gap Pads / Sheets Gap Filler Silicone 12 W/m-K 6.2 kVAC Gray - 60 C + 200 C 8 in 8 in 0.157 in UL 94 V-0 TGP 12000ULM
Bergquist Company Thermal Interface Products GAP PAD, 7W/m-K, Ultra-Low Modulus, GAP PAD TGP 7000ULM Drop Dispatch Lead Time 8 Weeks
Min.: 8
Mult.: 1

Gap Fillers / Gap Pads / Sheets Thermal Pad Non-standard Silicone 7 W/m-K 5 kVAC Gray - 60 C + 200 C 203.2 mm 203.2 mm 0.762 mm UL 94 V-0 TGP 7000ULM
Bergquist Company Thermal Interface Products 1-Part, Liquid Formable Material, 150CC Cartridge, 3.5 W/m-K, Liqui-Form Drop Dispatch Lead Time 11 Weeks
Min.: 16
Mult.: 1

Thermal Interface Materials Thermal Conductive Gel Paste Silicone Elastomer 3.5 W/m-K Gray - 60 C + 200 C UL 94 V-0 3500 / TLF LF3500
Bergquist Company Thermal Interface Products 1-Part, Liquid Formable Material, 300CC Cartridge, 3.5 W/m-K, Liqui-Form Drop Dispatch Lead Time 11 Weeks
Min.: 4
Mult.: 1

Thermal Interface Materials Thermally Conductive Liquid Formable Material Silicone Elastomer Gray - 60 C + 200 C UL 94 V-0 3500 / TLF LF3500
Bergquist Company Thermal Interface Products 1-Part, Liquid Formable Material, 4.33 Gallon Pail, 3.5 W/m-K, Liqui-Form Drop Dispatch Lead Time 8 Weeks
Min.: 1
Mult.: 1

Thermal Interface Materials Thermal Conductive Gel Paste Silicone Elastomer 3.5 W/m-K Gray - 60 C + 200 C 330.2 mm 330.2 mm UL 94 V-0 3500 / TLF LF3500
Bergquist Company Thermal Interface Products GAP PAD, 10W/m-K, 8" x 8" Sheet, 0.080" Thickness, TGP10000ULM, IDH 2591010 Drop Dispatch Lead Time 8 Weeks
Min.: 3
Mult.: 1

Gap Fillers / Gap Pads / Sheets Thermal Pad Non-standard Silicone 10 W/m-K 3.2 kVAC Gray - 60 C + 200 C 203.2 mm 203.2 mm 2.032 mm 25 psi UL 94 V-0 TGP 10000ULM
Bergquist Company Thermal Interface Products GAP PAD, 10W/m-K, 8" x 8" Sheet, 0.125" Thickness, TGP10000ULM, IDH 2599713 Drop Dispatch Lead Time 8 Weeks
Min.: 2
Mult.: 1

Gap Fillers / Gap Pads / Sheets Thermal Pad Non-standard Silicone 10 W/m-K 3.2 kVAC Gray - 60 C + 200 C 203.2 mm 203.2 mm 3.175 mm 25 psi UL 94 V-0 TGP 10000ULM
Bergquist Company Thermal Interface Products GAP PAD, 7W/m-K, 8" x 8" Sheet, 0.125" Thickness, TGP7000ULM, IDH 2474886 Drop Dispatch Lead Time 9 Weeks
Min.: 4
Mult.: 1

Gap Fillers / Gap Pads / Sheets Thermal Pad Non-standard Silicone 7 W/m-K 5 kVAC Gray - 60 C + 200 C 203.2 mm 203.2 mm 3.175 mm 22 psi UL 94 V-0 TGP 7000ULM
Bergquist Company Thermal Interface Products Thermally Conductive Gel Interface Material, 10 W/m-K, 0.8 Gallon Pail Drop Dispatch Lead Time 8 Weeks
Min.: 25
Mult.: 1

Gap Fillers / Gap Pads / Sheets Thermal Gel Silicone Elastomer 10 W/m-K Red - 60 C + 200 C UL 94 V-0 TLF 10000
Bergquist Company Thermal Interface Products Thermally Conductive Gel for Data & Telecom Market, 10 W/m-K, 30CC Syringe Drop Dispatch Lead Time 12 Weeks
Min.: 50
Mult.: 1

TLF 10000
Bergquist Company Thermal Interface Products GAP PAD, Conformable, Ultra-Low Modulus, TGP3500ULM/3500ULM Drop Dispatch Lead Time 16 Weeks
Min.: 6
Mult.: 1
Gap Fillers / Gap Pads / Sheets Thermal Pad Non-standard Silicone Elastomer 3.5 W/m-K 5 kVAC Gray - 60 C + 200 C 406.4 mm 203.2 mm UL 94 V-0 3500ULM / TGP 3500ULM
Bergquist Company Thermal Interface Products GAP PAD, 12 W/m-K, Ultra-Low Modulus, 8" x 8" Sheet, 0.060" Thickness Drop Dispatch Lead Time 19 Weeks
Min.: 4
Mult.: 1

Gap Fillers / Gap Pads / Sheets Gap Filler Silicone 12 W/m-K 6.2 kVAC Gray - 60 C + 200 C 8 in 8 in 0.157 in UL 94 V-0 TGP 12000ULM
Bergquist Company Thermal Interface Products GAP PAD, 12 W/m-K, Ultra-Low Modulus, 8" x 8" Sheet, 0.080" Thickness Drop Dispatch Lead Time 19 Weeks
Min.: 3
Mult.: 1

Gap Fillers / Gap Pads / Sheets Gap Filler Silicone 12 W/m-K 6.2 kVAC Gray - 60 C + 200 C 8 in 8 in 0.157 in UL 94 V-0 TGP 12000ULM
Bergquist Company Thermal Interface Products GAP PAD, 12 W/m-K, Ultra-Low Modulus, 8" x 8" Sheet, 0.100" Thickness Drop Dispatch Lead Time 19 Weeks
Min.: 3
Mult.: 1

Gap Fillers / Gap Pads / Sheets Gap Filler Silicone 12 W/m-K 6.2 kVAC Gray - 60 C + 200 C 8 in 8 in 0.157 in UL 94 V-0 TGP 12000ULM