Storage Applications

Bergquist Company Storage Applications feature advanced materials used in storage hardware to provide increased reliability, greater stability, and improved transfer rates. Every uptick in reliability and performance lowers costs while meeting increased user expectations. The thermal management materials from Bergquist Company include a broad variety of product types to meet various application needs.

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Description Datasheet Availability Pricing (EUR) Filter the results in the table by unit price based on your quantity.
Qty. RoHS ECAD Model Product
Type
Package/Case
Material
Thermal Conductivity
Breakdown Voltage
Color
Minimum Operating Temperature
Maximum Operating Temperature
Length
Width
Thickness
Tensile Strength
Flammability Rating
Series
Packaging
Bergquist Company Thermal Interface Products GAP PAD, 12 W/m-K, Ultra-Low Modulus, 8" x 8" Sheet, 0.120" Thickness
Datasheet
Drop Dispatch Lead Time 19 Weeks
Min.: 2
Mult.: 1

Gap Fillers / Gap Pads / Sheets Gap Filler Silicone 12 W/m-K 6.2 kVAC Gray - 60 C + 200 C 8 in 8 in 0.157 in UL 94 V-0 TGP 12000ULM
Bergquist Company Thermal Interface Products GAP PAD, 12 W/m-K, Ultra-Low Modulus, 8" x 8" Sheet, 0.160" Thickness
Datasheet
Drop Dispatch Lead Time 16 Weeks
Min.: 2
Mult.: 1

Gap Fillers / Gap Pads / Sheets Gap Filler Silicone 12 W/m-K 6.2 kVAC Gray - 60 C + 200 C 8 in 8 in 0.157 in UL 94 V-0 TGP 12000ULM
Bergquist Company Thermal Interface Products 1-Part, Liquid Formable Material, 600CC Cartridge, 3.5 W/m-K, Liqui-Form
Datasheet
Drop Dispatch Lead Time 16 Weeks
Min.: 4
Mult.: 1

Thermal Interface Materials Thermally Conductive Liquid Formable Material Silicone Elastomer Gray - 60 C + 200 C UL 94 V-0 3500 / TLF LF3500
Bergquist Company 2796659
Bergquist Company Thermal Interface Products Conductive Gel Interface for Data/Telecom, 10 W/m-K, 1 Gallon Pail, Liqui-Form
Datasheet
Drop Dispatch Lead Time 8 Weeks
Min.: 25
Mult.: 1

TLF 10000
Bergquist Company 3041247
Bergquist Company Thermal Interface Products GAP PAD, Silicone, 10 W/m-K, Ultra-Low Modulus, Cartridge(Cardboard), Industrial Drop Dispatch Lead Time 16 Weeks
Min.: 3
Mult.: 1

TGP 10000ULM
Bergquist Company 3041248
Bergquist Company Thermal Interface Products GAP PAD, Silicone, 10 W/m-K, Ultra-Low Modulus, Cartridge(Cardboard), Industrial Drop Dispatch Lead Time 16 Weeks
Min.: 3
Mult.: 1

TGP 10000ULM
Bergquist Company Thermal Interface Products Phase Change Material, Thin Bond, 8.5 W/m-K, 800W, 0.008" Thick, 11"x75' Roll
Datasheet

Phase Change Materials Phase Change Material Non-standard 5.3 W/m-K - 40 C + 150 C 0.203 mm UL 94 V-0 THF 5000UT
Bergquist Company Thermal Interface Products Phase Change Material, Thin Bond, 8.5 W/m-K, 800W, 0.010" Thick, 11"x75' Roll
Datasheet

Phase Change Materials Phase Change Material Non-standard 5.3 W/m-K - 40 C + 150 C 0.254 mm UL 94 V-0 THF 5000UT
Bergquist Company Thermal Interface Products Phase Change Material, Thin Bond, 8.5 W/m-K, 800W, 0.012" Thick, 11"x75' Roll
Datasheet

Phase Change Materials Phase Change Material Non-standard 5.3 W/m-K - 40 C + 150 C 3.07 mm UL 94 V-0 THF 5000UT