Data Centre Applications

Bergquist Company Data Center Applications feature advanced materials that help with thermal management, long-term reliability, and stress protection. Data center speeds and volumes are growing as analytics, artificial intelligence (AI), and high-performance computing go mainstream. This increased demand is causing next-generation data centers to run hotter, and this heat can degrade performance. Bergquist Company designs and manufactures component-level thermal management and stress protection products, which help meet these heightened performance requirements.

Results: 214
Select Image Part # Mfr. Description Datasheet Availability Pricing (EUR) Filter the results in the table by unit price based on your quantity. Qty. RoHS ECAD Model Product Type Package/Case Material Thermal Conductivity Breakdown Voltage Color Minimum Operating Temperature Maximum Operating Temperature Length Width Thickness Tensile Strength Flammability Rating Series Packaging
Bergquist Company 2166562
Bergquist Company Thermal Interface Products Thermally Conductive, Liquid Gap Filler, Gap Filler TGF 1500 / 1500 Drop Dispatch Lead Time 16 Weeks
Min.: 1.091
Mult.: 1

1500 / TGF 1500
Bergquist Company 2191820
Bergquist Company Thermal Interface Products Gap Filler (2-Part), No Spacer Beads, Pot Life=60m, 3.6 W/m-K, Dual Cartridge Drop Dispatch Lead Time 16 Weeks
Min.: 16
Mult.: 1

3500S35 / TGF 3600
Bergquist Company 2194283
Bergquist Company Thermal Interface Products Thermally Conductive, Liquid Gap Filler, Gap Filler TGF 1500 / 1500 Drop Dispatch Lead Time 16 Weeks
Min.: 1
Mult.: 1

1500 / TGF 1500
Bergquist Company 2196643
Bergquist Company Thermal Interface Products Thermally Conductive, Liquid Gap Filler, Gap Filler TGF 4000 / 4000 Drop Dispatch Lead Time 16 Weeks
Min.: 4
Mult.: 1

4000 / TGF 4000
Bergquist Company 2360801
Bergquist Company Thermal Interface Products Gap Filler (2-Part), No Spacer Beads, Pot Life=60m, 3.6 W/m-K, Dual Cartridge Drop Dispatch Lead Time 16 Weeks
Min.: 19
Mult.: 1

3500S35 / TGF 3600
Bergquist Company 2456488
Bergquist Company Thermal Interface Products Thermally Conductive, Liquid Gap Filler, Tube, Gap Filler TGF 3500LVO / 3500LV Drop Dispatch Lead Time 16 Weeks
Min.: 1
Mult.: 1

3500LV / TGF 3500LVO
Bergquist Company 2478317
Bergquist Company Thermal Interface Products Gap Filler, Thermally Conductive, Liquid Gap Filler, Dual Cartridge Drop Dispatch Lead Time 16 Weeks
Min.: 3
Mult.: 1

3500LV / TGF 3500LVO
Bergquist Company 2763109
Bergquist Company Thermal Interface Products Thermally Conductive, Liquid Gap Filler, Gap Filler TGF 3500LVO / 3500LV Drop Dispatch Lead Time 16 Weeks
Min.: 1
Mult.: 1

3500LV / TGF 3500LVO
Bergquist Company 2763110
Bergquist Company Thermal Interface Products Thermally Conductive, Liquid Gap Filler, Gap Filler TGF 3500LVO / 3500LV Drop Dispatch Lead Time 16 Weeks
Min.: 1
Mult.: 1

3500LV / TGF 3500LVO
Bergquist Company 3041247
Bergquist Company Thermal Interface Products GAP PAD, Silicone, 10 W/m-K, Ultra-Low Modulus, Cartridge(Cardboard), Industrial Drop Dispatch Lead Time 16 Weeks
Min.: 3
Mult.: 1

TGP 10000ULM
Bergquist Company 3041248
Bergquist Company Thermal Interface Products GAP PAD, Silicone, 10 W/m-K, Ultra-Low Modulus, Cartridge(Cardboard), Industrial Drop Dispatch Lead Time 16 Weeks
Min.: 3
Mult.: 1

TGP 10000ULM
Bergquist Company Thermal Interface Products Phase Change Material, Thin Bond, 8.5 W/m-K, 800W, 0.008" Thick, 11"x75' Roll

Phase Change Materials Phase Change Material Non-standard 5.3 W/m-K - 40 C + 150 C 0.203 mm UL 94 V-0 THF 5000UT
Bergquist Company Thermal Interface Products Phase Change Material, Thin Bond, 8.5 W/m-K, 800W, 0.010" Thick, 11"x75' Roll

Phase Change Materials Phase Change Material Non-standard 5.3 W/m-K - 40 C + 150 C 0.254 mm UL 94 V-0 THF 5000UT
Bergquist Company Thermal Interface Products Phase Change Material, Thin Bond, 8.5 W/m-K, 800W, 0.012" Thick, 11"x75' Roll

Phase Change Materials Phase Change Material Non-standard 5.3 W/m-K - 40 C + 150 C 3.07 mm UL 94 V-0 THF 5000UT