6-2355626-4

TE Connectivity
571-6-2355626-4
6-2355626-4

Mfr.:

Description:
DIMM Connectors DDR5 DIMM BLACK HSG AND BLACK LATCH

ECAD Model:
Download the free Library Loader to convert this file for your ECAD Tool. Learn more about the ECAD Model.

In Stock: 1.909

Stock:
1.909 Can Dispatch Immediately
Factory Lead Time:
8 Weeks Estimated factory production time for quantities greater than shown.
Quantities greater than 1909 will be subject to minimum order requirements.
Minimum: 1   Multiples: 1
Unit Price:
-,-- €
Ext. Price:
-,-- €
Est. Tariff:

Pricing (EUR)

Qty. Unit Price
Ext. Price
5,15 € 5,15 €
4,38 € 43,80 €
4,03 € 100,75 €
3,84 € 192,00 €
3,65 € 350,40 €
3,47 € 888,32 €
3,31 € 1.694,72 €
2,99 € 3.061,76 €

Product Attribute Attribute Value Select Attribute
TE Connectivity
Product Category: DIMM Connectors
RoHS:  
DIMM
DDR5
288 Position
0.85 mm
SMD/SMT
SMD/SMT
Vertical
Gold
1.5 A
Brand: TE Connectivity
Contact Material: Copper Alloy
Latch Color: Black
Maximum Operating Temperature: + 105 C
Minimum Operating Temperature: - 55 C
Product Type: DIMM Connectors
Factory Pack Quantity: 32
Subcategory: Memory Connectors & Sockets
Tail Length: 0.89 mm
Voltage Rating: 1.1 VDC
Products found:
To show similar products, select at least one checkbox
Select at least one checkbox above to show similar products in this category.
Attributes selected: 0

This functionality requires JavaScript to be enabled.

Compliance Codes
TARIC:
8536693000
USHTS:
8536694040
ECCN:
EAR99
Origin Classifications
Country of Origin:
China
Assembly Country of Origin:
Not available
Country of Diffusion:
Not available
The country is subject to change at the time of shipment.

DDR5 DIMM Sockets

TE Connectivity's DDR5 DIMM Sockets are next-generation memory hardware that is designed for high-performance computing and server platforms. These sockets support up to 6.4GT/s (Giga transfers per second) in bandwidth and provide space-saving features for better airflow between components. The DDR5 sockets also feature a 1A/pin current rating, 25 cycles durability, and increased reliability to withstand higher system shock and vibration. Typical applications include data centres, servers, High-Performance Computing (HPC) and workstations.