Sterling LWB+ Development Kits

Ezurio Sterling LWB+ Development Kits are designed to quickly demonstrate the functionality and versatility of the Sterling LWB+ Wi-Fi® 4 and BLUETOOTH® 5.2 Modules. The Sterling LWB+ Wi-Fi 4 and Bluetooth 5.2 Modules are based upon the Infineon AIROC™ CYW43439 chipset. The Sterling LWB+ Modules are a System-in-Package (SIP) with two certified module versions, supporting either an onboard chip antenna or an MHF connector for an external antenna. The Sterling LWB+ is intended to meet medical and industrial IoT connectivity requirements.

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Description Datasheet Availability Pricing (EUR) Filter the results in the table by unit price based on your quantity.
Qty. RoHS Product
Frequency
Tool Is For Evaluation Of
Operating Supply Voltage
Interface Type
Minimum Operating Temperature
Maximum Operating Temperature
Protocol - Bluetooth, BLE - 802.15.1
Protocol - WiFi - 802.11
Ezurio Multiprotocol Development Tools Sterling LWB+, Chip Antenna, Dev Kit CYW43439
Datasheet
2In Stock
Min.: 1
Mult.: 1

Development Kits 2.4 GHz 453-00085R, 453-00085C 3.3 V SDIO, UART - 40 C + 85 C Bluetooth 5.2 WiFi 4, 802.11 b/g/n
Ezurio Multiprotocol Development Tools Sterling LWB+, MHF4, Dev Kit CYW43439
Datasheet
Non-Stocked Lead-Time 20 Weeks
Min.: 1
Mult.: 1

Development Kits 2.4 GHz 453-00084R, 453-00084C 3.3 V SDIO, UART - 40 C + 85 C Bluetooth 5.2 WiFi 4, 802.11 b/g/n