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Passive Components

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Description Datasheet Availability Pricing (EUR) Filter the results in the table by unit price based on your quantity.
Qty. RoHS
JUMPtec 34006-0000-99-2
JUMPtec Heat Sinks HSP COMe-mBT10 slim thread
Product Comments
3Expected 2/26/2026
Min.: 1
Mult.: 1

JUMPtec 38017-0000-00-5
JUMPtec Computer-On-Modules - COM JUMPtec COMe Mount Kit 5mm 1set
Datasheet
Product Comments
4On Order
Min.: 1
Mult.: 1

congatec conga-HPC/mRLP-CSA-B
congatec CPU & Chip Coolers Standard active cooling solution for COM-HPC module conga-HPC/mRLP with 25mm overall heat sink height and integrated 12V fan. All standoffs are with 2.7mm bore hole.
Datasheet
2Expected 5/5/2026
Min.: 1
Mult.: 1

congatec conga-HPC/mRLP-CSA-T
congatec CPU & Chip Coolers Standard active cooling solution for COM-HPC module conga-HPC/mRLP with 25mm overall heat sink height and integrated 12V fan. All standoffs are M2.5mm threaded.
Datasheet
2Expected 5/5/2026
Min.: 1
Mult.: 1

congatec conga-HPC/mRLP-CSP-B
congatec CPU & Chip Coolers Standard passive cooling solution for COM-HPC module conga-HPC/mRLP with 24.2mm overall heat sink height. All standoffs are with 2.7mm bore hole.
Datasheet
2Expected 5/5/2026
Min.: 1
Mult.: 1

congatec conga-HPC/mRLP-HSP-B
congatec Heat Sinks Standard heatspreader for COM-HPC module conga-HPC/mRLP. All standoffs are with 2.7mm bore hole.
Datasheet
2Expected 5/5/2026
Min.: 1
Mult.: 1

congatec conga-TCR8/8845HS
congatec Computer-On-Modules - COM COM Express Type 6 Compact module based on AMD Ryzen Embedded 8845HS with 8 cores 3.8GHz up to 5.1GHz (boost) Integrated XDNA NPU Integrated RDNA 3 Graphics 24MB cache Dual channel SODIMM DDR5 5600 MT/s memory interface Commercial temp
1Expected 1/22/2027
Min.: 1
Mult.: 1

congatec CONGA-HPC/EVAL-MINI
congatec congatec Evaluation Carrier Board for COM-HPC Mini modules.
1On Order
Min.: 1
Mult.: 1
congatec Heat Sinks * Standard Heatspreader for SMARC 2.0 module conga-SA5* For modules with IHS Intel Atom CPU* All stand-offs are bore hole 2.7mm
Datasheet
Non-Stocked Lead-Time 3 Weeks
Min.: 1
Mult.: 1

JUMPtec Computer-On-Modules - COM JUMPtec COMe-mEL10 E2 x6425RE 8G/32G
Datasheet
Product Comments
5Factory Stock Available
More Info Available
Min.: 1
Mult.: 1

JUMPtec Computer-On-Modules - COM JUMPtec COMe-mBTi10 E3825 2GB
Datasheet
Product Comments
Non-Stocked Lead-Time 4 Weeks
Min.: 1
Mult.: 1

JUMPtec Computer-On-Modules - COM JUMPtec COMe-cAL6 N3350
Datasheet
Product Comments
Non-Stocked Lead-Time 6 Weeks
Min.: 1
Mult.: 1

JUMPtec Development Boards & Kits - x86 SMARC Evaluation Carrier 2.1
Datasheet
Product Comments
Non-Stocked Lead-Time 5 Weeks
Min.: 1
Mult.: 1

congatec Computer-On-Modules - COM Qseven 2.0 module based on Intel Atom x5 E3930 SoC (Dual-core, 6.5W TDP, CPU freq. 1.3/1.8GHz, GPU 12EU freq. 400/550MHz) with on-board memory 2GB DDR3L-1866 and 16GB eMMC.
Datasheet
Non-Stocked Lead-Time 9 Weeks
Min.: 1
Mult.: 1

congatec Heat Sinks * Standard passive cooling for Qseven module conga-QA5* For modules with IHS CPU* All stand-offs are M2.5 threaded
Datasheet
Non-Stocked Lead-Time 10 Weeks
Min.: 1
Mult.: 1

congatec Heat Sinks * Standard heatspreader for Qseven module conga-QA5* For modules with IHS CPU* All stand-offs are M2.5 threaded.
Datasheet
Non-Stocked Lead-Time 2 Weeks
Min.: 1
Mult.: 1

congatec Heat Sinks Standard heatspreader for Qseven module conga-QA7 with lidded Intel Atom x6000E processors. All standoffs are M2.5x0.45p threaded.
Datasheet
Non-Stocked Lead-Time 12 Weeks
Min.: 1
Mult.: 1
congatec Computer-On-Modules - COM Qseven module with ultra low power Freescale ARM Cortex A9 dual core 800MHz processor with 1MB L2 cache, 1GB onboard DDR3L memory and 4GB onboard eMMC. Lidded FCBGA package. Industrial grade temperature range from -40 C to 85 C.
Datasheet
Non-Stocked Lead-Time 3 Weeks
Min.: 1
Mult.: 1

congatec Computer-On-Modules - COM Qseven module with low-power 14nm NXP i.MX 8M Plus Quad processor. Features 4x ARM Cortex-A53 @1.6GHz +1x ARM Cortex-M7 + NPU, 4GB onboard LPDDR4 memory and 16GB onboard eMMC. Industrial grade temperature range from -40 C to 85 C.
Datasheet
Non-Stocked Lead-Time 6 Weeks
Min.: 1
Mult.: 1
congatec Heat Sinks Standard heatspreader for Qseven module conga-QMX8-Plus with NXP i.MX 8M Plus ARM processor. All standoffs are M2.5mm thread.
Datasheet
Non-Stocked Lead-Time 8 Weeks
Min.: 1
Mult.: 1
congatec Heat Sinks * Standard heatspreader for COM Express Mini Type10 module conga-MA5* For modules with IHS (lidded) CPU* All stand-offs are bore hole 2.7mm
Datasheet
Non-Stocked Lead-Time 10 Weeks
Min.: 1
Mult.: 1

congatec Heat Sinks *Heatspreader for Pico ITX board conga-PA7*For CPUs with standard silicone die*Four stand-offs M2.5 threaded
Datasheet
Non-Stocked Lead-Time 10 Weeks
Min.: 1
Mult.: 1
congatec CPU & Chip Coolers Passive cooling solution for COMe mini module conga-MA7 with lidded Intel Atom Exxx processor. All standoffs are M2.5 threaded
Datasheet
Non-Stocked Lead-Time 12 Weeks
Min.: 1
Mult.: 1

congatec Computer-On-Modules - COM SMARC 2.0 module with Intel Atom x7-E3950 quad core processor with 1.6GHz core frequency up to 2.0GHz, 2MB L2 cache, 8GB 2400MT/s LPDDR4 onboard memory and 32GB eMMC onboard flash.
Datasheet
Non-Stocked Lead-Time 9 Weeks
Min.: 1
Mult.: 1

congatec Heat Sinks Standard heatspreader for high performance COM Express module conga-TC570 with integrated heat pipes, 11mm overall heat sink height. All standoffs are with 2.7mm bore hole.
Datasheet
Non-Stocked Lead-Time 4 Weeks
Min.: 1
Mult.: 1