AMPMODU 1.0mm Centreline Interconnect System

TE Connectivity's (TE) AMPMODU 1.0mm Centerline Interconnect System offers an 85% space savings on the board when compared to the standard 2.54mm pitch connectors. A dual-beam contact design provides a reliable electrical connection even in severe shock/vibration environments. The TE AMPMODU 1.0mm Centerline Interconnect System serves a broad range of design requirements with up to 100 positions and two plating options with support for automated surface mounting and reflow processes.

Select Image Part # Mfr. Description Datasheet Availability Pricing (EUR) Filter the results in the table by unit price based on your quantity. Qty. RoHS ECAD Model Product Number of Positions Pitch Number of Rows Termination Style Mounting Angle Current Rating Voltage Rating Minimum Operating Temperature Maximum Operating Temperature Contact Plating Contact Material Housing Material Packaging
TE Connectivity Board to Board & Mezzanine Connectors SCL 1.0 RCPT DR VT 100 SMT G1 TBK Non-Stocked Lead-Time 9 Weeks
Min.: 300
Mult.: 300

Receptacles 100 Position 1 mm (0.039 in) 2 Row Solder Vertical 1 A 30 VAC - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) Tube
TE Connectivity Board to Board & Mezzanine Connectors SCL 1.0 RCPT DR VT 100 SMT G3 TBK Non-Stocked Lead-Time 9 Weeks
Min.: 250
Mult.: 250

Receptacles 100 Position 1 mm (0.039 in) 2 Row Solder Vertical 1 A 30 VAC - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) Tube