1-2397198-1

Name: TE Connectivity 1-2397198-1
Brand: TE Connectivity
SKU: 571-1-2397198-1
Price: 107.73 EUR
Availability: InStock

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Mouser No:

571-1-2397198-1

Mfr. No:

1-2397198-1

Mfr.:

TE Connectivity

Description:

IC & Component Sockets SOCKET 4710 FOR ODM

Lifecycle:

New Product:

New from this manufacturer.

Datasheet:

1-2397198-1 Datasheet

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In Stock: 58

Stock:: 58

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On Order:: 96

Expected 4/20/2026
Factory Lead Time:: 8

Weeks Estimated factory production time for quantities greater than shown.

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Pricing (EUR)

Qty.	Unit Price	Ext. Price
	107,73 €	107,73 €
	99,31 €	1.191,72 €
2.502	Quote

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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	TE Connectivity
Product Category:	IC & Component Sockets
RoHS:
Product:	Integrated Circuit (IC) Socket Cover
Number of Positions:	4710 Position
Type:	Mounting Socket Cover
Termination Style:	SMD/SMT
Contact Plating:	Gold
Minimum Operating Temperature:	- 40 C
Maximum Operating Temperature:	+ 100 C
Packaging:	Tray
Brand:	TE Connectivity
Country of Assembly:	Not Available
Country of Diffusion:	Not Available
Country of Origin:	CN
Product Type:	IC & Component Sockets
Factory Pack Quantity:	6
Subcategory:	IC & Component Sockets

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Datasheet

1-2397198-1 Datasheet

Specification Sheets

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TARIC:: 8536901000
USHTS:: 8536694040
ECCN:: EAR99

LGA 4710 Sockets

TE Connectivity's LGA 4710 Sockets support PCIe generation 5 technology and 8-channel DDR5 to provide more connections between the main board and the processor. These sockets feature DRAM memory up to 6400MT/s to increase performance and reduce overall power consumption. The LGA 4710 sockets deliver a 128 Gigabits per second aggregate link bandwidth in x16 configuration. These sockets offer a greater number of memory channels, enabling speed-intensive applications such as Artificial Intelligence (AI) and machine learning. The LGA 4710 sockets also support the auto-assembly process for ease of installation. These sockets are environmental, shock, and vibration resistance. Typical applications include data centers, hyperscale, next-generation servers, edge computing, AI and Machine Learning (ML).