90143-0010

Molex
538-90143-0010
90143-0010

Mfr.:

Description:
Headers & Wire Housings 2.54MM CGRIDIII HSG 10P DR W/O POL BTTN

ECAD Model:
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In Stock: 2.092

Stock:
2.092 Can Dispatch Immediately
Factory Lead Time:
5 Weeks Estimated factory production time for quantities greater than shown.
Minimum: 1   Multiples: 1
Unit Price:
-,-- €
Ext. Price:
-,-- €
Est. Tariff:

Pricing (EUR)

Qty. Unit Price
Ext. Price
0,74 € 0,74 €
0,628 € 6,28 €
0,56 € 14,00 €
0,533 € 53,30 €
0,50 € 125,00 €
0,474 € 237,00 €
0,442 € 442,00 €
0,415 € 1.037,50 €
0,402 € 2.010,00 €

Product Attribute Attribute Value Select Attribute
Molex
Product Category: Headers & Wire Housings
RoHS:  
Wire Housings
Receptacle Housing
10 Position
2.54 mm (0.1 in)
2 Row
Cable Mount / Free Hanging
Crimp
Socket (Female)
90143
C-Grid
Wire-to-Board, Signal
- 55 C
+ 105 C
Bulk
Brand: Molex
Country of Assembly: Not Available
Country of Diffusion: Not Available
Country of Origin: ID
Current Rating: 3 A
Flammability Rating: UL 94 V-1
Housing Colour: Black
Housing Material: Polyphenylene Oxide (PPO)
Product Type: Headers & Wire Housings
Factory Pack Quantity: 1
Subcategory: Headers & Wire Housings
Part # Aliases: 0901430010
Unit Weight: 453 mg
Products found:
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Attributes selected: 0

TARIC:
8547200090
CNHTS:
8547200000
CAHTS:
8536690020
USHTS:
8538906000
JPHTS:
853669000
KRHTS:
8536691000
MXHTS:
8536699999
BRHTS:
85366990
ECCN:
EAR99

C-Grid Connector System

Molex C-Grid Connector System is a dual row, wire-to-board system. The system includes vertical and right angle headers in breakaway, shrouded and dual-body styles, vertical and right angle receptacles, headers and receptacles for SMT applications, press-fit headers, and a 2-circuit shunt completes the C-Grid product line. Molex C-Grid Connector System has the ability to mate with SL and KK® products and is suitable for low power signal applications such as computers, medical instruments, and automotive controls.

C-Grid III™ Modular Interconnect Systems

Molex C-Grid III™ Modular Interconnect Systems are 3rd generation 2.54mm pitch header and receptacle interconnect systems offering unique design features. These interconnect systems offer complete design flexibility and modular components that provide the widest range of electronic packaging alternatives. The C-Grid III interconnect systems are based on north/south contact orientation and combine three different termination techniques including solder tail, crimp, and insulation displacement. These interconnected systems are fully compatible with the industry-standard DIN41651 as well as the French norm HE-13/14.