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FF4000UXTR33T2M1BPSA1

Name: Infineon FF4000UXTR33T2M1BPSA1
Brand: Infineon Technologies
SKU: 726-FF4000UXTR33T2M1
Price: 3622.72 EUR
Availability: InStock

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Mouser No:

726-FF4000UXTR33T2M1

Mfr. No:

FF4000UXTR33T2M1BPSA1

Mfr.:

Infineon Technologies

Description:

MOSFET Modules XHP HV

Lifecycle:

New Product:

New from this manufacturer.

Datasheet:

FF4000UXTR33T2M1BPSA1 Datasheet (PDF)

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Learn more about Infineon Technologies FF4000UXTR33T2M1BPSA1

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In Stock: 11

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Factory Lead Time:: 20 Weeks Estimated factory production time for quantities greater than shown.

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Pricing (EUR)

Qty.	Unit Price	Ext. Price
	3.622,72 €	3.622,72 €

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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	Infineon
Product Category:	MOSFET Modules
Delivery Restrictions:	This product may require additional documentation to export from the United States.
RoHS:
Technology:	SiC
Mounting Style:	Screw Mount
Package/Case:	XHP 2
Transistor Polarity:	N-Channel
Vds - Drain-Source Breakdown Voltage:	3.3 kV
Id - Continuous Drain Current:	500 A
Rds On - Drain-Source Resistance:	4.8 mOhms
Vgs - Gate-Source Voltage:	- 7 V, + 20 V
Vgs th - Gate-Source Threshold Voltage:	4.3 V
Pd - Power Dissipation:	20 mW
Series:	XHP 2
Packaging:	Tray
Brand:	Infineon Technologies
Configuration:	Dual
Country of Assembly:	DE
Country of Diffusion:	AT
Country of Origin:	DE
Fall Time:	60 ns
Product Type:	MOSFET Modules
Rise Time:	125 ns
Factory Pack Quantity:	1
Subcategory:	Discrete and Power Modules
Tradename:	XHP CoolSiC
Type:	Power Module
Typical Turn-Off Delay Time:	240 ns
Typical Turn-On Delay Time:	300 ns
Vf - Forward Voltage:	4.6 V
Part # Aliases:	FF4000UXTR33T2M1 SP005965418

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Datasheet

FF4000UXTR33T2M1BPSA1 Datasheet (PDF)

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TARIC:: 8541210000
CAHTS:: 8541210000
USHTS:: 8541210095
JPHTS:: 854121000
MXHTS:: 8541210100
ECCN:: 3A228.c

XHP™ 2 CoolSiC™ MOSFET Half-Bridge Modules

Infineon Technologies XHP™ 2 CoolSiC™ MOSFET Half-Bridge Modules are designed for applications ranging from 1.7kV to 3.3kV, featuring three AC terminals and four DC terminals to maximize current-carrying capabilities. The simple scalability of XHP 2 frame size, owing to the basic modular concept, makes these modules ready for future chip generations and fast-switching devices, enabling low losses. These modules offer low switching losses and high current density, enabled by a low inductive design. Mechanically, the modules provide high power density in a package with a Comparative Tracking Index (CTI) greater than 600, ensuring high creepage and clearance distances. An AlSiC base plate enhances thermal cycling capabilities, making these modules ideal for demanding applications.