TD190N16SOFHPSA2

Infineon Technologies
726-TD190N16SOFHPSA2
TD190N16SOFHPSA2

Mfr.:

Description:
Discrete Semiconductor Modules L#T-BOND MODULE

Datasheet:
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Learn more about Infineon Technologies TD190N16SOFHPSA2

Product Attribute Attribute Value Select Attribute
Infineon
Product Category: Discrete Semiconductor Modules
RoHS:  
Thyristor-Diode Modules
Phase Control
Si
1.6 kV
Screw Mount
PB34
- 40 C
+ 125 C
Tray
Brand: Infineon Technologies
Configuration: SCR/Diode Phase Control
Gate Trigger Current - Igt: 145 mA
Holding Current Ih Max: 200 mA
Id - Continuous Drain Current: 30 mA
Product Type: Discrete Semiconductor Modules
Factory Pack Quantity: 8
Subcategory: Discrete and Power Modules
Typical Delay Time: 2 us
Typical Turn-Off Delay Time: 320 us
Part # Aliases: TD190N16SOF SP001206284
Unit Weight: 165 g
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Compliance Codes
TARIC:
8541300000
CNHTS:
8504901900
CAHTS:
8541300000
USHTS:
8541300080
JPHTS:
854130000
ECCN:
EAR99
Origin Classifications
Country of Origin:
Germany
Assembly Country of Origin:
Hungary
Country of Diffusion:
Germany
The country is subject to change at the time of shipment.

Eco Block Solder Bond Modules

Infineon Eco Block Solder Bond Modules are ideal for applications where the high robustness of pressure contact technology is not necessarily a must. Typical applications are drives, power supplies, and soft starters. Designers benefit from improved terminal design for symmetric current sharing and the 100% x-ray monitoring of solder process which leads to predictably high performance and lifetime. With the second generation for 34mm, you can get increased current ratings (up to 240A).

Solder Bond Power Block IGBT Modules

Infineon Solder Bond Power Block IGBT Modules are bipolar power modules that are in a solder bond technology to address the specific requirements of cost-effective applications. These Power Block modules expands its already comprehensive power module portfolio which, so far, was only using pressure contacts. With market prices of approximately 25 percent (depending on module/application) less than related pressure contact variants solder bond modules offer significant cost advantages in modules with smaller packages sizes of up to 50mm. The small solder Power Block modules are ideal for applications like standard drives or UPS, where the high robustness of pressure contacts is not necessarily a must.

Availability

Stock:
0

You can still purchase this product for backorder.

On Order:
16
Expected 6/17/2027
Factory Lead Time:
52
Weeks Estimated factory production time for quantities greater than shown.
Long lead time reported on this product.
Minimum: 1   Multiples: 1
Unit Price:
-,-- €
Ext. Price:
-,-- €
Est. Tariff:

Pricing (EUR)

Qty. Unit Price
Ext. Price
50,15 € 50,15 €
37,89 € 303,12 €
34,43 € 3.580,72 €

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