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FS1150R08A8P3LMCHPSA1

Name: Infineon FS1150R08A8P3LMCHPSA1
Brand: Infineon Technologies
SKU: 726-FS1150R08A8P3LMC
Price: 495.29 EUR
Availability: InStock

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Mouser No:

726-FS1150R08A8P3LMC

Mfr. No:

FS1150R08A8P3LMCHPSA1

Mfr.:

Infineon Technologies

Description:

Discrete Semiconductor Modules HYBRID PACK DRIVE G2 SI

Lifecycle:

New Product:

New from this manufacturer.

Datasheet:

FS1150R08A8P3LMCHPSA1 Datasheet (PDF)

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In Stock: 9

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Factory Lead Time:: 26 Weeks Estimated factory production time for quantities greater than shown.

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Pricing (EUR)

Qty.	Unit Price	Ext. Price
	495,29 €	495,29 €
	440,97 €	5.291,64 €

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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	Infineon
Product Category:	Discrete Semiconductor Modules
RoHS:
Technology:	Si
Series:	G2
Packaging:	Tray
Brand:	Infineon Technologies
Product Type:	Discrete Semiconductor Modules
Factory Pack Quantity:	6
Subcategory:	Discrete Semiconductor Modules
Tradename:	HybridPACK
Part # Aliases:	FS1150R08A8P3LMC SP005908114

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Datasheet

FS1150R08A8P3LMCHPSA1 Datasheet (PDF)

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TARIC:: 8541290000
CNHTS:: 8504409100
CAHTS:: 8541290000
USHTS:: 8541290065
JPHTS:: 854129000
MXHTS:: 8541299900
ECCN:: EAR99

HybridPACK™ Drive G2 Modules

Infineon Technologies HybridPACK™ Drive G2 Modules are compact power modules designed for hybrid and electric vehicle traction. The Infineon Technologies G2 modules offer scalable performance levels using Si or SiC technologies and different chipsets, maintaining the same module size. Introduced in 2017 with silicon EDT2 technology, it was optimized for efficiency in real-world driving. In 2021, a CoolSiC™ version was introduced, offering higher cell density and better performance. In 2023, the second generation, HybridPACK Drive G2, was launched with EDT3 (Si IGBT) and CoolSiC™ G2 MOSFET technologies, providing ease of use and integration options for sensors, enabling up to 300kW performance within 750V and 1200V classes.