F413MXTR12C1M2QH11BPSA1

Infineon Technologies
726-F413MXTR12C1M2QH
F413MXTR12C1M2QH11BPSA1

Mfr.:

Description:
MOSFET Modules EasyPACK 1C CoolSiC MOSFET M2 .XT, fourpack module 1200 V, 13 mOhm with NTC temperature sensor, pre-applied thermal interface material 2.0 and high current PressFIT contact technology

Lifecycle:
New Product:
New from this manufacturer.
Datasheet:
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Learn more about Infineon Technologies F413MXTR12C1M2QH11BPSA1

Product Attribute Attribute Value Select Attribute
Infineon
Product Category: MOSFET Modules
RoHS:  
SiC
Press Fit
1.2 kV
60 A
25.2 mOhms
- 10 V, + 25 V
4.3 V
- 40 C
+ 175 C
20 mW
EasyPACK C series
Tray
Brand: Infineon Technologies
Fall Time: 14 ns
Height: 12 mm
If - Forward Current: 30 A
Length: 39 mm
Product: MOSFET Module
Product Type: MOSFET Modules
Rise Time: 12 ns
Factory Pack Quantity: 30
Subcategory: Discrete and Power Modules
Tradename: CoolSiC
Type: MOSFET
Typical Turn-Off Delay Time: 39 ns
Typical Turn-On Delay Time: 24 ns
Vf - Forward Voltage: 4.35 V
Width: 32.4 mm
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Datasheet

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Compliance Codes
TARIC:
8541210000
CAHTS:
8541210000
USHTS:
8541210095
JPHTS:
854121000
MXHTS:
8541210100
ECCN:
EAR99
Origin Classifications
Country of Origin:
Austria
Assembly Country of Origin:
Germany
Country of Diffusion:
Not available
The country is subject to change at the time of shipment.

EasyPACK™ C Series CoolSiC MOSFETs Modules

Infineon Technologies EasyPACK™ C Series CoolSiC MOSFETs Modules combine second-generation CoolSiC trench MOSFETs with the low inductance Easy C series platform and .XT interconnect technology. These Infineon modules deliver ultra-low switching losses, tighter parasitic control, and enhanced robustness during power cycling. Rugged PressFIT pins, integrated NTC sensing, integrated mounting clamps, and high CTI insulation streamline assembly and support demanding mission profiles. Available in four-pack (F4) and 3-level (F3) topologies, the series is offered in 8mΩ and 13mΩ resistance classes to help users raise switching frequency, shrink magnetics, and boost power density while maintaining EMI performance and thermal margin.

EasyPACK™ CoolSiC™ Trench MOSFET Modules

Infineon Technologies EasyPACK™ CoolSiC™ Trench MOSFET Modules feature PressFIT contact technology and an integrated Negative Temperature Coefficient (NTC) temperature sensor. These modules operate at a 1200V drain-source voltage, feature a low inductive design, low switching losses, and high current density. The EasyPACK™ modules offer rugged mounting due to integrated mounting clamps and are packaged with a CTI >600. Applications include high-frequency switching devices, DC/DC converters, and DC chargers for EVs. With the Easy 2C Series, Infineon enhances high-power designs using SiC G2 technology and advanced .XT features. The .XT technology provides enhanced ruggedness and extended operating temperatures, while the second-generation SiC MOSFET technology offers improved gate oxide reliability and reduced on-resistance.

1200V CoolSiC™ Modules

Infineon Technologies 1200V CoolSiC™ Modules are Silicon Carbide (SiC) MOSFET modules that offer good levels of efficiency and system flexibility. These modules come with Near Threshold Circuits (NTC) and PressFIT contact technology. The CoolSiC modules feature high current density, best in class switching and conduction losses, and low inductive design. These modules provide high-frequency operation, increased power density, and optimized development cycle time and cost.

In Stock: 30

Stock:
30 Can Dispatch Immediately
Factory Lead Time:
26 Weeks Estimated factory production time for quantities greater than shown.
Minimum: 1   Multiples: 1
Unit Price:
-,-- €
Ext. Price:
-,-- €
Est. Tariff:
This Product Ships FREE

Pricing (EUR)

Qty. Unit Price
Ext. Price
119,24 € 119,24 €
112,19 € 1.121,90 €

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