ARRAYJ-60035-64P-PCB

onsemi
863-ARYJ6003564PPCB
ARRAYJ-60035-64P-PCB

Mfr.:

Description:
Photodiodes J-ARRAY 6MM 35U 8X8

Datasheet:
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Learn more about onsemi ARRAYJ-60035-64P-PCB

In Stock: 12

Stock:
12 Can Dispatch Immediately
Factory Lead Time:
35 Weeks Estimated factory production time for quantities greater than shown.
Minimum: 1   Multiples: 1
Unit Price:
-,-- €
Ext. Price:
-,-- €
Est. Tariff:
This Product Ships FREE

Pricing (EUR)

Qty. Unit Price
Ext. Price
2.801,84 € 2.801,84 €

Product Attribute Attribute Value Select Attribute
onsemi
Product Category: Photodiodes
RoHS:  
Photodiode Arrays
PCB Mount
420 nm
7.5 uA
250 ps
- 40 C
+ 85 C
ArrayJ
Brand: onsemi
Packaging: Bulk
Product Type: Photodiodes
Factory Pack Quantity: 1
Subcategory: Optical Detectors & Sensors
Tradename: SensL
Unit Weight: 54,770 g
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Attributes selected: 0

TARIC:
8541490000
CNHTS:
8541490000
CAHTS:
8541490010
USHTS:
8541491050
JPHTS:
854149000
BRHTS:
85414900
ECCN:
EAR99

Silicon Photomultipliers (SiPMs)

onsemi Silicon Photomultipliers (SiPMs) feature high gain, fast timing, and excellent PDE with practical advantages associated with solid state technology (SST). These onsemi SiPMs offer a fast output terminal and are manufactured using a CMOS process. The SiPMs have a breakdown voltage uniformity of ±250mV across all sensors in a product line, a low-temperature coefficient of 21mV/°C, and <30V bias voltage. These SiPMs are ideal for medical imaging, hazard and threat, 3D ranging and imaging, and high energy physics.

J-Series Array SiPM Sensors

onsemi J-Series Array Silicon Photomultiplier (SiPM) Sensors have been used to create high fill-factor, scalable arrays. The TSV-packaged sensors are mounted onto PCB boards with minimal dead space. The Array-J products are available in a variety of formats and formed of either 3mm, 4mm or 6mm pixels. The back of each Array-J has either one or more multi-way connectors or a BGA (ball grid array). This allows for access to each pixel's standard output, and in some cases, the fast output as well.

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