4102000

Wurth Elektronik
710-4102000
4102000

Mfr.:

Description:
Screws & Fasteners WE-TMA M3 Nut Steel M3

Lifecycle:
New Product:
New from this manufacturer.
ECAD Model:
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In Stock: 100

Stock:
100 Can Dispatch Immediately
Factory Lead Time:
22 Weeks Estimated factory production time for quantities greater than shown.
Minimum: 1   Multiples: 1
Unit Price:
-,-- €
Ext. Price:
-,-- €
Est. Tariff:

Pricing (EUR)

Qty. Unit Price
Ext. Price
0,206 € 0,21 €
0,181 € 1,81 €
0,165 € 8,25 €
0,148 € 14,80 €
0,14 € 70,00 €
0,132 € 132,00 €

Product Attribute Attribute Value Select Attribute
Wurth Elektronik
Product Category: Screws & Fasteners
RoHS:  
Brand: Wurth Elektronik
Packaging: Tray
Product Type: Screws & Fasteners
Series: WE-TMA
Factory Pack Quantity: 50
Subcategory: Hardware
Unit Weight: 220 mg
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Attributes selected: 0

Compliance Codes
USHTS:
7318160060
ECCN:
EAR99
Origin Classifications
Country of Origin:
Taiwan
Assembly Country of Origin:
Not available
Country of Diffusion:
Not available
The country is subject to change at the time of shipment.

Heat Sink Solutions

Würth Elektronik Heat Sink Solutions are designed to provide effective thermal management to improve performance, reduce system failure, and increase the lifespans of electronics. These high-performance heatsink solutions include WE-HIC and WE-HICI heatsinks for ICs, WE-HTO and WE-HTOI heatsinks for transistors, and WE-TMA accessories for mounting the heatsinks and transistors. The WE-HIC are standard heatsinks, while the WE-HICI are heatsinks with pre-applied thermal interface material. These heatsinks for ICs are available in unidirectional and bidirectional variants in four different sizes. The WE-HTO are standard heatsinks, while the WE-HTOI are heatsinks with pre-applied thermal interface material. These heatsinks for transistors are designed specifically for TO-220 and TO-247 packages. The transistor heatsinks are constructed from black-anodized aluminum and available in four types, including simple, curved, clip-on, and extruded. Applications include Ball Grid Array (BGA), Pin Grid Array (PGA), CPU, DC/DC converter, and microcontrollers.