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W66AP6NBQAHJ

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See Product Specifications

Mouser No:

454-W66AP6NBQAHJ

Mfr. No:

W66AP6NBQAHJ

Mfr.:

Winbond

Description:

DRAM 1Gb LPDDR4, x16, 2133MHz, -40C 105C

Lifecycle:

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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	Winbond
Product Category:	DRAM
Type:	SDRAM - LPDDR4
Memory Size:	1 Gbit
Maximum Clock Frequency:	2.133 GHz
Package/Case:	TFBGA-200
Organisation:	64 M x 16
Access Time:	3.6 ns
Supply Voltage - Min:	1.7 V
Supply Voltage - Max:	1.95 V
Minimum Operating Temperature:	- 40 C
Maximum Operating Temperature:	+ 105 C
Packaging:	Tray
Brand:	Winbond
Country of Assembly:	Not Available
Country of Diffusion:	Not Available
Country of Origin:	Not Available
Moisture Sensitive:	Yes
Mounting Style:	SMD/SMT
Product Type:	DRAM
Factory Pack Quantity:	144
Subcategory:	Memory & Data Storage

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Filter Document:

PCN

Product Change Notification 2024-10-11 (PDF)

CAHTS:: 8542320020
USHTS:: 8542320032
MXHTS:: 8542320299
ECCN:: EAR99

DRAM Product Portfolio

Winbond DRAM Product Portfolio consists of Mobile RAM and Specialty DRAM for consumer, communication, peripheral, industrial, and automobile markets. Specialty DRAM features high performance and a high speed for a complete solution. The SDR, DDR, DDR2, and DDR3 feature support for industrial and automotive applications with AEC-Q100, TS16949, ISO9001/14001, OHSAS18001 certificates. Winbond provides professional advice to KGD customers, including SiP package bonding and power/thermal, DRAM simulation, and wafer level on speed tests.