W66AP6NBQAFJ

Winbond
454-W66AP6NBQAFJ
W66AP6NBQAFJ

Mfr.:

Description:
DRAM 1Gb LPDDR4, x16, 1600MHz, -40C-105C

Lifecycle:
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ECAD Model:
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More Information
Learn more about Winbond W66AP6NBQAFJ

In Stock: 118

Stock:
118 Can Dispatch Immediately
Factory Lead Time:
53 Weeks Estimated factory production time for quantities greater than shown.
Quantities greater than 118 will be subject to minimum order requirements.
Long lead time reported on this product.
Minimum: 1   Multiples: 1   Maximum: 118
Unit Price:
-,-- €
Ext. Price:
-,-- €
Est. Tariff:

Pricing (EUR)

Qty. Unit Price
Ext. Price
6,58 € 6,58 €

Product Attribute Attribute Value Select Attribute
Winbond
Product Category: DRAM
RoHS:  
SDRAM - LPDDR4
1 Gbit
2.133 GHz
TFBGA-200
64 M x 16
3.6 ns
1.7 V
1.95 V
- 40 C
+ 105 C
Tray
Brand: Winbond
Country of Assembly: Not Available
Country of Diffusion: Not Available
Country of Origin: TW
Moisture Sensitive: Yes
Mounting Style: SMD/SMT
Product Type: DRAM
Factory Pack Quantity: 144
Subcategory: Memory & Data Storage
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Attributes selected: 0

CNHTS:
8542329010
CAHTS:
8542320020
USHTS:
8542320032
MXHTS:
8542320299
ECCN:
EAR99

DRAM Product Portfolio

Winbond DRAM Product Portfolio consists of Mobile RAM and Specialty DRAM for consumer, communication, peripheral, industrial, and automobile markets. Specialty DRAM features high performance and a high speed for a complete solution. The SDR, DDR, DDR2, and DDR3 feature support for industrial and automotive applications with AEC-Q100, TS16949, ISO9001/14001, OHSAS18001 certificates. Winbond provides professional advice to KGD customers, including SiP package bonding and power/thermal, DRAM simulation, and wafer level on speed tests.

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