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W25Q32RVSSJM

Name: Winbond W25Q32RVSSJM
Brand: Winbond
SKU: 454-W25Q32RVSSJM
Price: 0.74 EUR
Availability: InStock

Mouser No:

454-W25Q32RVSSJM

Mfr. No:

W25Q32RVSSJM

Mfr.:

Winbond

Description:

NOR Flash spiFlash, 32M-bit, 4Kb Uniform Sector, DTR

Lifecycle:

Verify Status with Factory:

Lifecycle information is unclear. Obtain a quote to verify the availability of this part number from the manufacturer.

ECAD Model:

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More Information

Learn more about Winbond W25Q32RVSSJM

In Stock: 192

Stock:: 192 Can Dispatch Immediately

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Factory Lead Time:: 24 Weeks Estimated factory production time for quantities greater than shown.

Quantities greater than 192 will be subject to minimum order requirements.

Long lead time reported on this product.

Enter Quantity:

Minimum: 1 Multiples: 1 Maximum: 100

Unit Price:

-,-- €

Ext. Price:

-,-- €

Est. Tariff:

Pricing (EUR)

Qty.	Unit Price	Ext. Price
	0,748 €	0,75 €
	0,731 €	7,31 €

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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	Winbond
Product Category:	NOR Flash
RoHS:
Packaging:	Tube
Brand:	Winbond
Moisture Sensitive:	Yes
Product Type:	NOR Flash
Factory Pack Quantity:	90
Subcategory:	Memory & Data Storage

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Attributes selected: 0

Filter Document:

PCN

Product Change Notification 2026-1-21 (PDF)

Compliance Codes

TARIC:: 8542326100
CNHTS:: 8542329090
CAHTS:: 8542320040
USHTS:: 8542320051
MXHTS:: 8542320299
ECCN:: 3A991.b.1.a

Origin Classifications

Country of Origin:: Taiwan
Assembly Country of Origin:: Not available
Country of Diffusion:: Not available

The country is subject to change at the time of shipment.

DRAM Product Portfolio

Winbond DRAM Product Portfolio consists of Mobile RAM and Specialty DRAM for consumer, communication, peripheral, industrial, and automobile markets. Specialty DRAM features high performance and a high speed for a complete solution. The SDR, DDR, DDR2, and DDR3 feature support for industrial and automotive applications with AEC-Q100, TS16949, ISO9001/14001, OHSAS18001 certificates. Winbond provides professional advice to KGD customers, including SiP package bonding and power/thermal, DRAM simulation, and wafer level on speed tests.