W25N01GWZEIG

Winbond
454-W25N01GWZEIG
W25N01GWZEIG

Mfr.:

Description:
NAND Flash 1G-bit Serial NAND flash, 1.8V

Lifecycle:
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Lifecycle information is unclear. Obtain a quote to verify the availability of this part number from the manufacturer.
Datasheet:
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Learn more about Winbond W25N01GWZEIG

In Stock: 171

Stock:
171
Can Dispatch Immediately
On Order:
252
Expected 2/24/2026
252
Expected 7/30/2026
Factory Lead Time:
24
Weeks Estimated factory production time for quantities greater than shown.
Quantities greater than 675 will be subject to minimum order requirements.
Long lead time reported on this product.
Minimum: 1   Multiples: 1   Maximum: 126
Unit Price:
-,-- €
Ext. Price:
-,-- €
Est. Tariff:

Pricing (EUR)

Qty. Unit Price
Ext. Price
4,31 € 4,31 €
4,02 € 40,20 €
3,90 € 97,50 €
3,81 € 190,50 €

Product Attribute Attribute Value Select Attribute
Winbond
Product Category: NAND Flash
RoHS:  
SMD/SMT
WSON-8
W25N01GW
1 Gbit
SPI
128 M x 8
Asynchronous
8 bit
1.7 V
1.95 V
35 mA
- 40 C
+ 85 C
Tube
Active Read Current - Max: 35 mA
Brand: Winbond
Maximum Clock Frequency: 104 MHz
Moisture Sensitive: Yes
Product Type: NAND Flash
Factory Pack Quantity: 63
Subcategory: Memory & Data Storage
Tradename: SpiFlash
Unit Weight: 1,710 g
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Attributes selected: 0

CNHTS:
8542329090
USHTS:
8542320051
ECCN:
3A991.b.1.b.1

QspiNAND Flash Memory

Winbond QspiNAND Flash Memory is high-performance, low-power memory built with Single-Level Cell (SLC) memory technology and implementing 1-bit Error Correction Code (ECC) on all read and write operations. The integrated ECC detects and corrects errors and enables contiguous good memory (bad block management). This feature offloads these functions from an external controller. The QspiNAND Flash Memory also supports Executive-in-Place (XiP) functionality, in which an SoC or processor executes application code directly from the external flash memory without shadowing it to DRAM.

FEATURED PRODUCTS
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