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CD-02-05-C-54

Name: Wakefield Thermal CD-02-05-C-54
Brand: Wakefield Thermal
SKU: 567-CD-02-05-C-54
Price: 7.03 EUR
Availability: InStock

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Mouser No:

567-CD-02-05-C-54

Mfr. No:

CD-02-05-C-54

Mfr.:

Wakefield Thermal

Description:

Thermal Interface Products ulTIMiFlux Dielectric Phase Change, Chipset Pad 2.106" x 2.106", No Hole

Datasheet:

CD-02-05-C-54 Datasheet (PDF)

ECAD Model:

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Learn more about Wakefield Thermal CD-02-05-C-54

In Stock: 502

Stock:: 502 Can Dispatch Immediately

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Factory Lead Time:: 9 Weeks Estimated factory production time for quantities greater than shown.

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Pricing (EUR)

Qty.	Unit Price	Ext. Price
	7,03 €	7,03 €
	6,30 €	63,00 €
	6,00 €	150,00 €
	5,78 €	289,00 €
	5,52 €	552,00 €
	5,25 €	1.312,50 €
	5,04 €	2.520,00 €
	4,67 €	4.670,00 €
	4,42 €	11.050,00 €

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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	Wakefield Thermal
Product Category:	Thermal Interface Products
RoHS:
Product:	Phase Change Materials
Type:	Thermal Pad
Package/Case:	Non-standard
Material:	Phase Change Compound
Breakdown Voltage:	9.2 kVAC
Color:	Orange
Maximum Operating Temperature:	+ 60 C
Length:	2.106 in
Width:	2.106 in
Thickness:	0.076 mm
Tensile Strength:	100 psi
Flammability Rating:	UL 94 V-0
Series:	CD
Brand:	Wakefield Thermal
Designed for:	Chipset
Product Type:	Thermal Interface Products
Factory Pack Quantity:	500
Subcategory:	Thermal Management
Tradename:	ulTIMiFlux

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Datasheet

CD-02-05-C-54 Datasheet (PDF)

RoHS Certificate (PDF)

Compliance Codes

CAHTS:: 3920990000
USHTS:: 3920992000
MXHTS:: 3920990200
ECCN:: EAR99

Origin Classifications

Country of Origin:: United States
Assembly Country of Origin:: Not available
Country of Diffusion:: Not available

The country is subject to change at the time of shipment.

ulTIMiFlux Thermal Material

Wakefield Thermal ulTIMiFlux Thermal Material offers high performance, cost-effectiveness, configurability, and custom sizes for thermal system needs. Thermal Interface Material (TIM) is a secondary material installed between the heat sink and the device and is designed to improve the thermal transfer to the heat sink. The Wakefield Thermal line of dielectric phase change thermal materials are intended to fill voids between a device and the heat sink. The ulTIMiFlux material utilizes a polyimide film to act as a thermally conductive carrier to deliver uniform thickness coating of phase-change thermal compound on both sides. These materials are an effective drop-in-place solution that makes an excellent replacement for thermal greases.