LPH0004

Versarien
489-LPH0004
LPH0004

Mfr.:

Description:
Heat Sinks The factory is currently not accepting orders for this product.

Lifecycle:
Verify Status with Factory:
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ECAD Model:
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In Stock: 407

Stock:
407 Can Dispatch Immediately
Quantities greater than 407 will be subject to minimum order requirements.
Long lead time reported on this product.
Minimum: 1   Multiples: 1
Unit Price:
-,-- €
Ext. Price:
-,-- €
Est. Tariff:

Pricing (EUR)

Qty. Unit Price
Ext. Price
11,88 € 11,88 €
10,88 € 108,80 €
10,24 € 256,00 €
9,65 € 482,50 €
9,31 € 931,00 €
8,86 € 2.215,00 €
8,54 € 4.270,00 €
8,24 € 8.240,00 €

Product Attribute Attribute Value Select Attribute
Versarien
Product Category: Heat Sinks
RoHS:  
Heat Sinks
Component, 20x20mm
Copper
20 mm
20 mm
5 mm
Brand: Versarien
Product Type: Heat Sinks
Series: LPH
Factory Pack Quantity: 1
Subcategory: Heat Sinks
Tradename: VersarienCu
Unit Weight: 14,128 g
Products found:
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Attributes selected: 0

TARIC:
7616999099
CNHTS:
7419809100
USHTS:
7419805050
JPHTS:
741980000
KRHTS:
7419809000
ECCN:
EAR99

Low Profile Metallic Foam Heat Sinks

Versarien Low Profile Metallic Foam Heat Sinks offer unparalleled thermal performance in low-profile applications. These heat sinks use VersarienCu™ micro-porous metallic copper foam. The interconnected pores of the foam create a large surface area. The surface area combined with the excellent thermal conductivity of copper allow for the height of the heat sinks to be reduced without sacrificing performance. A thin, hard layer of high temperature copper oxide improves the emissivity of the foam, boosting the radiant properties of the heat sink and reducing the temperature of the component. Versarien Low Profile Metallic Foam Heat Sinks are designed for use in passive cooling applications where space is at a premium and performance is crucial. VersarienCu heat sinks can be used to cool any IC (integrated circuit) component.

FEATURED PRODUCTS
VERSARIEN