TLP184(TPL,E)

Toshiba
757-TLP184TPLE
TLP184(TPL,E)

Mfr.:

Description:
Transistor Output Optocouplers Photo-IC 50mA 80V 3750 Vrms Ext Temp

Lifecycle:
NRND:
Not recommended for new designs.
Datasheet:
ECAD Model:
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More Information
Learn more about Toshiba TLP184(TPL,E)

Availability

Stock:
Non-Stocked
Factory Lead Time:
Minimum: 1   Multiples: 1
Unit Price:
-,-- €
Ext. Price:
-,-- €
Est. Tariff:

Pricing (EUR)

Qty. Unit Price
Ext. Price
0,611 € 0,61 €
0,402 € 4,02 €
0,268 € 26,80 €
0,186 € 93,00 €
0,17 € 170,00 €
Full Reel (Order in multiples of 3000)
0,144 € 432,00 €
0,142 € 852,00 €
0,129 € 1.161,00 €
0,124 € 2.976,00 €

Similar Product

Toshiba TLP184(TPL,SE
Toshiba
Transistor Output Optocouplers 50mA Photocoupler 80V 50mA 3750Vrms
Compare With Current Part

Product Attribute Attribute Value Select Attribute
Toshiba
Product Category: Transistor Output Optocouplers
RoHS:  
SMD/SMT
SOIC-6
1 Channel
3750 Vrms
NPN Phototransistor
16 mA
1.4 V
80 V
50 mA
300 mV
5 us
9 us
200 mW
- 50 C
+ 110 C
TLP184
Reel
Cut Tape
Brand: Toshiba
Current Transfer Ratio: 400 %
Product Type: Transistor Output Optocouplers
Factory Pack Quantity: 3000
Subcategory: Optocouplers
Unit Weight: 80 mg
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Attributes selected: 0

Datasheet

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Compliance Codes
TARIC:
8541401000
CNHTS:
8541410000
CAHTS:
8541410000
USHTS:
8541410000
JPHTS:
8541400103
MXHTS:
8541410100
BRHTS:
85414011
ECCN:
EAR99
Origin Classifications
Country of Origin:
Thailand
Assembly Country of Origin:
Not available
Country of Diffusion:
Not available
The country is subject to change at the time of shipment.

TLP18x Photocoupler GaAs Ired & Photo Transistors

Toshiba TLP18x Photocoupler GaAs Ired and Photo Transistors are small outline couplers that are suitable for surface-mount assembly. They each consist of a photo transistor, optically coupled to a gallium arsenide infrared emitting diode. The TLP184 is also connected inverse parallel and can operate directly by AC input current. Toshiba TLP18x Photocoupler GaAs Ired and Photo Transistors are smaller than a DIP package, making them suitable for high-density, surface-mounting applications such as programmable controllers.

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