TJ90S04M3L,LQ

Toshiba
757-TJ90S04M3LLQ
TJ90S04M3L,LQ

Mfr.:

Description:
MOSFETs Pb-F POWER MOSFET TRANSISTOR DPAK+ PD=180W F=1MHZ

ECAD Model:
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In Stock: 7.044

Stock:
7.044 Can Dispatch Immediately
Factory Lead Time:
20 Weeks Estimated factory production time for quantities greater than shown.
Minimum: 1   Multiples: 1
Unit Price:
-,-- €
Ext. Price:
-,-- €
Est. Tariff:
Packaging:
Full Reel (Order in multiples of 2000)

Pricing (EUR)

Qty. Unit Price
Ext. Price
Cut Tape / MouseReel™
2,53 € 2,53 €
1,64 € 16,40 €
1,14 € 114,00 €
1,01 € 505,00 €
0,963 € 963,00 €
Full Reel (Order in multiples of 2000)
0,877 € 1.754,00 €
† A MouseReel™ fee of 5,00 € will be added and calculated in your basket. All MouseReel™ orders are non-cancellable and non-returnable.

Product Attribute Attribute Value Select Attribute
Toshiba
Product Category: MOSFETs
RoHS:  
Si
SMD/SMT
DPAK-3 (TO-252-3)
P-Channel
1 Channel
40 V
90 A
4.3 mOhms
- 20 V, 10 V
1 V
172 nC
- 55 C
+ 175 C
180 W
Enhancement
U-MOSVI
Reel
Cut Tape
MouseReel
Brand: Toshiba
Configuration: Single
Country of Assembly: Not Available
Country of Diffusion: Not Available
Country of Origin: JP
Fall Time: 426 ns
Product Type: MOSFETs
Rise Time: 76 ns
Series: TJ20A10M3
Factory Pack Quantity: 2000
Subcategory: Transistors
Transistor Type: 1 P-Channel
Typical Turn-Off Delay Time: 1305 ns
Typical Turn-On Delay Time: 94 ns
Unit Weight: 360 mg
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TARIC:
8541290000
CNHTS:
8541290000
CAHTS:
8541290000
USHTS:
8541290065
JPHTS:
854129000
MXHTS:
8541299900
ECCN:
EAR99

U-MOSVI Small Signal MOSFETs

Toshiba U-MOSVI Small Signal MOSFETs offer a variety of gate drive voltages required for many different types of mobile devices. They are available in single, dual, N-channel, P-channel and various voltage versions, providing a wide variety of options for designers. Each MOSFET addresses the need to support high-current charging with low voltage and low RDS(on) requirements. The compact packages and and low voltage operation make Toshiba U-MOSVI Small Signal MOSFETs an ideal solution for high-density packaging requirements in smart phones and game consoles.