SSM3J325F,LF

Toshiba
757-SSM3J325FLF
SSM3J325F,LF

Mfr.:

Description:
MOSFETs P-Ch Small Signal 270pF -2A -20V 4.6nC

ECAD Model:
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In Stock: 2.958

Stock:
2.958
Can Dispatch Immediately
On Order:
3.000
Expected 3/16/2026
21.000
Expected 4/17/2026
Factory Lead Time:
18
Weeks Estimated factory production time for quantities greater than shown.
Minimum: 1   Multiples: 1
Unit Price:
-,-- €
Ext. Price:
-,-- €
Est. Tariff:
Packaging:
Full Reel (Order in multiples of 3000)

Pricing (EUR)

Qty. Unit Price
Ext. Price
Cut Tape / MouseReel™
0,335 € 0,34 €
0,218 € 2,18 €
0,137 € 13,70 €
0,095 € 47,50 €
0,079 € 79,00 €
Full Reel (Order in multiples of 3000)
0,06 € 180,00 €
0,054 € 324,00 €
0,046 € 414,00 €
0,045 € 1.080,00 €
† A MouseReel™ fee of 5,00 € will be added and calculated in your basket. All MouseReel™ orders are non-cancellable and non-returnable.

Product Attribute Attribute Value Select Attribute
Toshiba
Product Category: MOSFETs
RoHS:  
Si
SMD/SMT
SOT-346-3
P-Channel
1 Channel
20 V
2 A
311 mOhms
- 8 V, 8 V
1 V
4.6 nC
- 55 C
+ 150 C
600 mW
Enhancement
U-MOSVI
Reel
Cut Tape
MouseReel
Brand: Toshiba
Configuration: Single
Country of Assembly: TH
Country of Diffusion: JP
Country of Origin: TH
Forward Transconductance - Min: 4.4 S
Product Type: MOSFETs
Series: SSM3J325
Factory Pack Quantity: 3000
Subcategory: Transistors
Transistor Type: 1 P-Channel
Unit Weight: 12 mg
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Attributes selected: 0

TARIC:
8541290000
CNHTS:
8541210000
CAHTS:
8541290000
USHTS:
8541210095
JPHTS:
8541290100
KRHTS:
8541299000
MXHTS:
85412999
ECCN:
EAR99

U-MOSVI Small Signal MOSFETs

Toshiba U-MOSVI Small Signal MOSFETs offer a variety of gate drive voltages required for many different types of mobile devices. They are available in single, dual, N-channel, P-channel and various voltage versions, providing a wide variety of options for designers. Each MOSFET addresses the need to support high-current charging with low voltage and low RDS(on) requirements. The compact packages and and low voltage operation make Toshiba U-MOSVI Small Signal MOSFETs an ideal solution for high-density packaging requirements in smart phones and game consoles.